The study of IGZO was started by Kimizuka et al. in 1985. IGZO is developed as a material for displays. We found crystalline IGZO having c-axis alignment and have studied its application to displays, memories, processors, etc. Crystalline IGZO is expected to be used in a variety of applications.
By using an oxide semiconductor, we successfully prototyped a 3.4-inch QHD LCD panel including data and scan drivers; their power consumption is reduced by variable frame frequency (from 1/60 fps to 120 fps) depending on images. Low frame frequency in displaying still images on a PC monitor can reduce eyestrain.
Our crystalline In–Ga–Zn oxide (IGZO) thin film has a c‐axis‐aligned crystal (CAAC) structure and maintains crystallinity even on an amorphous base layer. Although the crystal has c‐axis alignment, its a‐axis and b‐axis have random arrangement; moreover, a clear grain boundary is not observed. We fabricated a back‐channel‐etched thin‐film transistor (TFT) using the CAAC‐IGZO film. Using the CAAC‐IGZO film, more stable TFT characteristics, even with a short channel length, can be obtained, and the instability of the back channel, which is one of the biggest problems of IGZO TFTs, is solved. As a result, we improved the process of manufacturing back‐channel‐etched TFTs.
We report, in this paper, that crystalline In–Ga–Zn-oxide (IGZO) can be formed over an amorphous surface or over an uneven surface by a sputtering process at lower than 500 °C through the purification of IGZO. Crystalline IGZO, in which no clear grain boundary is observed, shows c-axis alignment but random a- and b-axis orientations without alignment. This crystal morphology differs from other morphologies that have been known thus far, such as single crystal and polycrystal morphologies. Our model for understanding the formation of this crystal morphology [c-axis-aligned crystal (CAAC)] is also discussed. Upon thermal annealing of a deposited film at lower than 500 °C, nanocrystal regions remaining in the CAAC can be converted into the CAAC structure. Accordingly, I
off can be at the yA/µm (10−24 A/µm) level at 85 °C. It has been proven that by utilizing normally-off characteristics even with L/W = 40 nm/40 nm (actual size: L/W = 68 nm/34 nm), the fabrication of a three-dimensional (3D) LSI with a 3D oxide semiconductor/Si hybrid structure is feasible.
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