1985
DOI: 10.1109/edl.1985.26206
|View full text |Cite
|
Sign up to set email alerts
|

Backgating characteristics of MODFET structures

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
2
0

Year Published

1987
1987
2012
2012

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 19 publications
(2 citation statements)
references
References 4 publications
0
2
0
Order By: Relevance
“…6 In these device measurements a variable back-gate potential could originate at the gate electrodes or their bond pads. The predominant dependence of the observed threshold voltage shift on the detailed shape of the continuous gate, increasing with increasing length of protrusion, indicates that parasitic gating via the substrate can only be a second-order effect.…”
mentioning
confidence: 99%
“…6 In these device measurements a variable back-gate potential could originate at the gate electrodes or their bond pads. The predominant dependence of the observed threshold voltage shift on the detailed shape of the continuous gate, increasing with increasing length of protrusion, indicates that parasitic gating via the substrate can only be a second-order effect.…”
mentioning
confidence: 99%
“…This technique has previously been used in wider bandgap semiconductors such as GaAs and InP to form planar devices and define device active regions in the fabrication of HEMTs [11], IMPATT diodes [12] and in defining buried heterostructures in laser diodes [13]. A potential advantage to using ion implantation over a diffusion based technique is the greater flexibility in the species to be implanted, as well as potential to achieve greater depths with good uniformity.…”
Section: Introductionmentioning
confidence: 99%