Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

Abstract

In this study, the high-speed deformation behavior of solder joints formed withPb-free Zn-Sn and commercial Pb-Sn alloys bonded on different substrateswas investigated by the ball impact test method. Overall, Zn-Sn jointsexhibited greater impact strength but inferior impact toughness than Pb-Snjoints. This can be ascribed to the high hardness of Zn-Sn solders resulting inpartial or overall interfacial fracture. In contrast, the joints with soft Pb-Snsolders all showed a ductile fracture feature. It is suggested that, for the jointsrevealing brittle fracture, the impact toughness (impact energy) increasedwith the plastic ability of interfacial intermetallic compounds, while for thoseshowing a ductile fracture mode, the impact energy deteriorated with ahardened solder matrix resulting from substrate dissolution

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

“…The Sn atoms keep the channel molten. Therefore, we observed similar scallop-type intermetallic compounds at the interface [26,27]. In comparison, when pure molten Zn reacts with Cu, a layered CueZn compound tends to form, rather than scallop phases [28].…”

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

“…An Instron micro-impact test apparatus was applied for BIT testing. The principle and practice of BIT are described in detail elsewhere [1,2,[16][17][18]. A striker was ejected upon the release of an air-compressed spring of which the velocity (V i ) was 0.6 m/s in this study.…”

“…In order to study the board-level solder joint reliability, a ball impact test (BIT) suffering high strain rate deformation was developed. Similar to a board-level drop test, BIT usually gives rise to brittle fracture at the interfacial IMCs [1,2].…”

Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder

“…With an increase in E/H, the relative elastic recovery becomes less, hence resulting in a greater degree of plastic deformation. 19 Based on this concept, the E/H values of these phase of the interface were calculated and are listed in Table II. The ability for plasticity of these phase in decreasing order was: Zn-20Sn, Zn-20Sn-0.5RE, CuZn 5 , Cu 5 Zn 8 .…”