Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages

An alternative solder interconnect reliability test to evaluate drop impact performance

“…In this test the solder ball is sheared off using a chisel like tool. Several researches compared one of the methods with drop impact testing [6,7]. It seems CBP testing has an advantage over high-speed shear testing.…”

A testing method for assessing solder joint reliability of FCBGA packages

“…Ball shear test has been used for monitoring the solder joint strength for BGA packages [5][6][7][8][9]. However, ball shear testing did not detect the correct failure mode in the brittle solder joint for flip chip ball grid array (FCBGA) packages.…”

Correlation between Package‐Level High‐Speed Solder Ball Shear/Pull and Board‐Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy

“…Currently the most popular method to evaluate the strength of the solder ball attachment is the ball shear test [6][7][8][9][10][11][12][13], which is adopted from the Joint Electron Device Engineering Council (JEDEC) standard JESD22-B117A [6]. Currently, a new method called the ball pull test has emerged as an attractive alternative to the traditional ball shear test as an interconnect monitor [11,12].…”

“…Many researchers and engineers used the conventional ball shear test (shearing speed is less than 0.8 mm/sec) to evaluate the reliability of solder joints in the past decade [7][8][9][10][11][12][13]. Huang et al (2001 and2002) first studied the ball shear test in terms of the effects of shear speed and shear height [8,9].…”

“…Huang et al (2001 and2002) first studied the ball shear test in terms of the effects of shear speed and shear height [8,9]. He employed both experimental and finite element analysis techniques to investigate the effects on the ball shear test of the conventional SnPb solder with a NSMD (non-solder mask defined) type substrate.…”