In this paper, a novel β-Ga 2 O 3 high electron mobility transistor (BGO-HEMT) with record-high intrinsic unity current gain cutoff frequency (f T) of 166 GHz and RF output power (P OUT) of 2.91 W/mm is demonstrated through 2D device simulations using an appropriate negative differential mobility model. The highly scaled proposed device uses 10 nm AlN barrier layer on 50 nm β-Ga 2 O 3 buffer with gate-length (L G) of 50 nm and aspect-ratio (gate length to barrier thickness) of 5 ensures significant gain in high-frequency performance. The novel device design offers very low access and dynamic resistance due to highly doped n + access regions, and a finite gap between ohmic contacts and barrier layer to mitigate source choking effect. The device's superior DC and RF performance is well supported by large two-dimensional electron gas (2DEG) density (n s) of the order of 10 13 cm −2 due to large band discontinuity in AlN/β-Ga 2 O 3 heterostructure and highly polarized AlN material. The device shows maximum drain current density (I DMAX) of 11.5 A/mm and peak transconductance (g m) of 0.917 S/mm at V DS = 15 V and V GS = 0 and − 7 V respectively. Furthermore, the term 2π (f T × L G) for the device shows a value of 0.5 × 10 7 cm/s, very close to v sat of 1.5 × 10 7 cm/s in β-Ga 2 O 3. These promising results enhance the potential of β-Ga 2 O 3 for future high power RF and microwave applications.