Base solder voids identification of IGBT modules using case temperature

A junction temperature model based on heat flow distribution in an IGBT module with solder layer voids

“…Li et al [ 18 ] measured the incremental thermal resistance of a baseplate solder layer as it aged and introduced this into the thermal resistance network. Fan et al [ 19 ] proposed a method to identify baseplate solder layer voids and assess void damage indirectly using case temperature. Cai et al [ 20 ] discussed the effect of solder layer voids on a thermal impedance matrix and modified the thermal impedance matrix.…”

Construction and Application of a Complex Network-Based Case Knowledge Base in an Assisted Instruction System

“…In the business administration field, building such a system not only provides a rich case resource library, but also further taps into potential knowledge and insights using complex network technology to analyze the correlation between cases [11][12][13][14]. This system not only enables students to learn and understand the core concepts and methods of business administration more systematically, but also enables teachers to prepare courses and guide students more efficiently [15][16][17][18].…”