BCB-based wafer-level packaged single-crystal silicon multi-port RF MEMS switch

Kim, J.-m.; Lee, S.; Baek, Chang-Wook; Kwon, Youngwoo; Kim, Y.-k.

doi:10.1049/el:20083288

Cited by 7 publications

(11 citation statements)

References 4 publications

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“…The multilayer rim provides a packaging volume to encapsulate RF MEMS devices, as well as controls the gap between the slot and signal (feeding) lines on the RF MEMS wafer for optimal feeding of the antenna. Polymer adhesive bonding using BCB intermediate layer is used to stack the antenna on the RF MEMS substrate, because BCB is known to have excellent microwave properties and good resistance to gas and moisture, thereby has been widely used for RF packaging materials [7].…”

Section: Antenna On the Rf Mems Packaging Platformmentioning

confidence: 99%

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Low‐loss silicon‐on‐quartz (SoQ)‐based aperture‐coupled antenna on RF MEMS packaging platform

Lim

Hyun

Kim

et al. 2009

Micro & Optical Tech Letters

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This letter presents a micromachined aperture‐coupled antenna which improves antenna performances as well as simplifies a fabrication process. The SoQ (silicon‐on‐quartz) bonding and BCB (benzocyclobutene) adhesive bonding are employed for a radio frequency microelectro‐mechanical system (RF‐MEMS) packaging platform. The SoQ/BCB packaging platform makes the air cavity and the quartz substrate where the aperture‐coupled antenna is stacked. Therefore, radiation performances can be enhanced from low‐loss air/quartz substrates while a silicon substrate has almost no effects on radiation. Furthermore, the proposed method enables simultaneous integration of the antenna with the RF MEMS devices through a single packaging process. In this letter, the antenna is manufactured based on the proposed method and the fabrication process is carefully described. The s‐parameters and shear strength are measured to evaluate both of antenna and packaging performances. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 52: 125–128, 2010; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24874

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Section: Antenna On the Rf Mems Packaging Platformmentioning

confidence: 99%

“…In this work, the glass wafer is used as the RF MEMS substrate to implement single-crystal siliconbased MEMS switches in the future [7,8], but any type of RF MEMS substrates can be used.…”

Section: Antenna On the Rf Mems Packaging Platformmentioning

confidence: 99%

Low‐loss silicon‐on‐quartz (SoQ)‐based aperture‐coupled antenna on RF MEMS packaging platform

Lim

Hyun

Kim

et al. 2009

Micro & Optical Tech Letters

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“…The proposed RF MEMS probe array system consists of an RF MEMS SP3T silicon switch, which is well known as a type of RF MEMS switch with good reliability [7,8], and RF MEMS transmission lines with three planar-type apertures [9]. As the three probes have an identical structure, the purpose of this probe array system is to obtain a spatial scan.…”

Section: Rf Mems Probe Array Systemmentioning

confidence: 99%

“…We proposed to use an RF MEMS switch instead of a conventional coaxial bulky switch. An RF MEMS switch with a silicon membrane shows good performance in terms of not only RF characteristics but also reliability [7,8]. The proposed hybrid system consists of an RF MEMS SP3T silicon switch and an RF MEMS probe array.…”

Section: Introductionmentioning

confidence: 99%

A hybrid RF MEMS probe array system with a SP3T RF MEMS silicon switch for permittivity measurement

Kim¹,

Cheon²,

Kwon³

et al. 2008

J. Micromech. Microeng.

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This paper reports a hybrid RF MEMS probe array system for permittivity measurements. A single-pole triple-throw (SP3T) RF MEMS silicon switch and a novel surface micromachined transmission line with three planar apertures were designed, fabricated and measured. These MEMS devices were connected using wire bonding and bond wire effects were cancelled as a consequence of in-liquid calibration of the whole system. A permittivity measurement of 0.9% saline was made by operating each RF MEMS silicon switch. The measured result showed good agreement with the reference value from the Cole–Cole equation up to 20 GHz. This result shows the feasibility of the proposed hybrid RF MEMS probe array system for permittivity measurements.

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“…On the other hand, the capacitive RF MEMS switch has a frequency range over a few GHz, because the switch is operated by capacitance variation. Generally, in terms of structure simplicity, charging problem, compatibility with a microstrip line, robustness, and reliability, the ohmic contact RF MEMS switch performs better than the capacitive RF MEMS switch for frequencies less than 50 GHz [4][5][6]. In this paper, by using dual axis movement the SPDT ohmic contact switch is used up to 100 GHz.…”

Section: Introductionmentioning

confidence: 99%

A 50–100 GHz ohmic contact SPDT RF MEMS silicon switch with dual axis movement

Sim

Lee

Jang

et al. 2016

Microelectronic Engineering

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We firstly show the prototype of an ohmic contact Single-Pole Double-Throw Radio Frequency Micro-Electro-Mechanical Systems (SPDT RF MEMS) switch operating at 50-100 GHz. The fabricated ohmic contact SPDT RF MEMS silicon switch moves both laterally and vertically, to improve the isolation at high frequencies by initially misaligning the contact part of the switch over a Coplanar Waveguide (CPW) transmission line. The lateral and vertical movement of the switch is operated by using comb and parallel plate actuators, respectively. The proposed switch was fabricated using Silicon-On-Glass (SiOG) bonding process. The insertion loss of the fabricated switch is measured according to the different operation states of the switch, in the range from 50 to 100 GHz. The fabricated length of the transmission line is 4.6 mm and the measured insertion loss and isolation are 9.13 dB and 24.37 dB at 70 GHz, respectively. Keyword 2 RF MEMS switch; high isolation; dual axis movement; silicon switch

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BCB-based wafer-level packaged single-crystal silicon multi-port RF MEMS switch

Cited by 7 publications

References 4 publications

Low‐loss silicon‐on‐quartz (SoQ)‐based aperture‐coupled antenna on RF MEMS packaging platform

Low‐loss silicon‐on‐quartz (SoQ)‐based aperture‐coupled antenna on RF MEMS packaging platform

A hybrid RF MEMS probe array system with a SP3T RF MEMS silicon switch for permittivity measurement

A 50–100 GHz ohmic contact SPDT RF MEMS silicon switch with dual axis movement

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