Behavior of Si-Si Bond Oxidation by Electron Beam Lithography

Abstract

Lithography using siloxane polymers is reasonable for process reduction compared to mask etching process. Generally, crosslinkable groups, such as acrylates and epoxides, and protecting groups are added to siloxane polymers for lithography. We synthesized polydiphenylsilane without those functional groups, and the thermal behavior of that was observed with TG-DSC-MS. The thermal elimination of phenyl group from polydiphenylsilane was observed and the thermal weight loss until 500 °C was under 3%. The polysilane film was directly imaged with EB nano melting apparatus (ENF-3500) and line width of pattern was 12.9 µm. The film thicknesses before and after development were same. The partial heating by EB irradiation caused oxidation of polydiphenylsilane after elimination reaction of phenyl group and cleavage of Si-Si bond by XPS analysis.

Experimental and Computational Analyses of the Oxidation Mechanism of the Poly(arylsilane) Family as the Side Reaction during the Baking Process

“…The conditions for the synthesis of polymethylphenylsilane (PMPS) have been described previously. , Mg powder (40 mmol), LiCl (20 mmol), and ZnCl 2 (4 mmol) under a N 2 atmosphere were added to THF (30 mL, dried over Na) in a 30 mL round-bottom flask and stirred to dissolve LiCl and ZnCl 2 to THF for an hour. Methylphenyldichlorosilane (30 mmol) was added into the flask, and the mixture was stirred for 24 h at room temperature.…”

Insights on toxicity, safe handling and disposal of silica aerogels and amorphous nanoparticles

“…The thermal degradation of, e.g., poly(methylphenyl silane), shows that the Si-Si cleavage occurs at temperature around 400°C, with an onset degradation temperature of approximately 300°C . 142 However, this process is not effective, corresponding only to a small fraction of the weight loss percentage of the polysilane. Furthermore, thermal decomposition, which may also include incineration, leads to an increase in the carbon dioxide emissions.…”

Thermal Aspects of Kumada Rearrangement in Symmetrical and Asymmetrical Polysilanes-Interdependence of Molecular Structure, Thermal Degradation, and Stability

“…Later in 1950, Burkhard reported the synthesis of di-alkyl derivatives by following the same route as Kipping [9]; however, the resultant polymers were characterized as white powders and found to be insoluble in many organic solvents, it was also observed that the consequent white powder started to decompose without melting when it is heated above 250°C (also known as intractable material) and evoked less scienti c interest. Polysilanes are used as thermal precursors for synthesizing ceramic materials [10,11], which was initially proposed by Yajima and his co-workers by successfully transforming polydimethylsilane to β-SiC bers with a proper heat treatment process [12].…”