Absolute calibrated hyperspectral photoluminescence (PL) imaging is utilized to access, in a simple and fast way, the spatial distribution of relevant solar cell parameters such as quasi‐Fermi level splitting (QFLS), optical diode factor (ODF), Urbach energies Eu and shunt resistances Rsh, without the need for electrical measurements. Since these metrics play a significant role in evaluating the process windows for electrical series interconnection by laser patterning, this approach is followed to systematically locate and quantify electrical losses that may occur as a result of the laser patterning process for monolithic series interconnection. It is shown that both ps and ns laser pulses can be used for successful series interconnection. In both cases, only minor lateral material alterations occur, localized in a few µm wide region adjacent to the edges of the scribe lines. Furthermore, the acquisition and analysis of these hyperspectral PL datasets provides insights in the material removal process, from which we conclude that the perovskite is rather resilient against the thermal impact of the laser.This article is protected by copyright. All rights reserved.