Bending and twisting of pipe with creep

Lau, John H.

doi:10.1016/0029-5493(81)90166-7

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2001

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Cited by 4 publications

References 5 publications

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Thermomechanics for Electronics Packaging

Lau¹

1993

Thermal Stress and Strain in Microelectronics Packaging

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Thermomechanics for Electronics Packaging

Lau¹

1993

Thermal Stress and Strain in Microelectronics Packaging

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Bending and twisting of cylindrical solder interconnections with creep

Lau

2001

Soldering & Surface Mount Tech

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An exact analysis is presented of the creep deformation of cylindrical solder interconnects subjected to the actions of bending moments, twisting moments, and axial forces. Dimensionless interaction curves and charts are also provided for engineering practice convenience. These charts show the interactions of the relevant variables, i.e. interconnect geometry; solder material properties; axial force; bending moment; twisting moment; bending stress; shearing stress; curvature rate; and twist rate. In the results presented the Garofalo‐Arrhenius steady‐state creep equation is used to provide the constitutive relationship for SnPb36Ag2 solder interconnects.

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Creep of 96.5Sn3.5Ag Solder Interconnects

Lau

1993

Soldering &Amp; Surface Mount Technology

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An exact analysis is presented for the creep deformation of solder interconnects subjected to the actions of bending moment, twisting moment and axial force. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, axial force, bending moment, twisting moment, bending stress, shearing stress, curvature rate and twist rate are also provided for engineering practice convenience. The constitutive relationship of the 96.5Sn3.5Ag solder interconnects is described by the Garofalo‐Arrhenius steady‐state creep equation.

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Bending and twisting of pipe with creep

Cited by 4 publications

References 5 publications

Thermomechanics for Electronics Packaging

Thermomechanics for Electronics Packaging

Bending and twisting of cylindrical solder interconnections with creep

Creep of 96.5Sn3.5Ag Solder Interconnects

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