Benzo‐cyclo‐butene bonding process with ‘stamp’ printing for wafer level package

Xia, Wen; Li, Lei; Deng, Kangfa; Li, Song; Su, Weiguo; Zhang, Wei

doi:10.1049/mnl.2014.0137

Cited by 2 publications

(1 citation statement)

References 11 publications

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“…The result is a narrow process window, and thus a reduced robustness of the process. Other reported methods for the creation of patterned adhesive layers are local dispensing, screen printing, and stamp-printing [ 9 , 19 , 20 ]. Dispensing and printing methods often suffer from poor layer thickness control, imprecise alignment, and limited resolution of the patterned adhesive layer.…”

Section: Introductionmentioning

confidence: 99%

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

et al. 2016

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Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based on low-temperature adhesive wafer bonding, which ensures full complementary metal-oxide-semiconductor (CMOS) compatibility. All necessary fabrication steps for the wafer bonding, such as cavity formation and deposition of the adhesive, are performed on the capping substrate. The polymer adhesive is deposited by spray-coating on the capping wafer containing the cavities. Thus, no lithographic patterning of the polymer adhesive is needed, and material waste is minimized. Furthermore, this process does not require any additional fabrication steps on the device wafer, which lowers the process complexity and fabrication costs. We demonstrate the proposed capping method by packaging two different MEMS devices. The two MEMS devices include a vibration sensor and an acceleration switch, which employ two different electrical interconnection schemes. The experimental results show wafer-level capping with excellent bond quality due to the re-flow behavior of the polymer adhesive. No impediment to the functionality of the MEMS devices was observed, which indicates that the encapsulation does not introduce significant tensile nor compressive stresses. Thus, we present a highly versatile, robust, and cost-efficient capping method for components such as MEMS and imaging sensors.

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Section: Introductionmentioning

confidence: 99%

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

et al. 2016

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Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Wakeel,

Morrisey,

Genc

et al. 2023

J. Optical Microsystems

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Micro-transfer printing (μTP) has been widely used to integrate photonic components, such as lasers, modulators, photodetectors, micro-LEDs, on Si photonic platforms. There is a push toward the μTP of optical components in photonics packaging as it enables wafer-scale integration with high alignment accuracy. We demonstrate for the first time the μTP of thick optical components, such as micro-lenses, in the range of 250 to 1000 μm thickness. We explore the reliability of bonding such components using an ultraviolet (UV) curable epoxy and compare them with the current state of the art. The results show that the average shear strength of lenses bonded with InterVia is 19 MPa which is higher than currently used optical epoxies. Also, μTP process has no effect on the surface roughness and microstructure of lenses. Using our approach, we demonstrate how thick silicon and fused silica lenses can be integrated into photonic integrated circuits (PICs) using a tether-free process that is highly scalable and robust.

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Benzo‐cyclo‐butene bonding process with ‘stamp’ printing for wafer level package

Cited by 2 publications

References 11 publications

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

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