1990
DOI: 10.1109/33.56168
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Benzocyclobutene interlayer dielectrics for thin film multichip modules

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Cited by 28 publications
(15 citation statements)
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“…One wafer was left uncured and two other wafers were cured at two different temperatures below and above 200°C, which is the activation temperature of BCB polymerization [31,32]. The exact cure temperatures are listed in Table 6.…”
Section: Characterization Of Cmp For Bcb Polymersmentioning
confidence: 99%
“…One wafer was left uncured and two other wafers were cured at two different temperatures below and above 200°C, which is the activation temperature of BCB polymerization [31,32]. The exact cure temperatures are listed in Table 6.…”
Section: Characterization Of Cmp For Bcb Polymersmentioning
confidence: 99%
“…For the FPA presented in this paper photo-sensitive BCB was used. The advantage of BCB compared to similar materials, such as polyimide, is a lower dielectric loss, a lower mechanical stress and a lower processing temperature [6]. The FPA is fabricated by Acreo AB, Norrköping, Sweden [7], in a modified MCM-D process that comprises three layers of 15 m thick BCB and four Cu metal layers.…”
Section: Manufacturing Technologymentioning
confidence: 99%
“…Relevant references on the behavior of BCB monomers 99 and 100, introduced by Dow Chemical, were published in specialized technical papers. [161][162][163] When properly cured at 250°C under nitrogen to avoid oxidation, BCB polymers have a Tg of 350°C, a dielectric constant below 2.8, dielectric losses below 0.001 and a water absorption of 0.2-0.3 wt% after 24 h in boiling water. However, high sensitivity to air oxidation and poor adhesive properties are serious drawbacks which deserve further investigation.…”
Section: Benzocyclobutene-terminated Polymersmentioning
confidence: 99%