2012
DOI: 10.1016/j.electacta.2012.07.036
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Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

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Cited by 68 publications
(114 citation statements)
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“…The physical origin of these temporal instabilities is a so-called N-shaped negative differential resistance (N-NDR) [39,40] that, within a relatively narrow current range, is manifested by potential oscillations during chronopotentiometric measurements. The plot shows seven regular potential oscillations that are attributed to sequential formation of the stable Imep-Cu(I)-MPS suppressor film and its partial dissolution (deactivation) at the interface [29,30]. The intervals at higher overpotentials comprised between sharp potential steps correspond to an active Imep-Cu(I)-MPS diffusional barrier being operative at the interface.…”
Section: Resultsmentioning
confidence: 99%
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“…The physical origin of these temporal instabilities is a so-called N-shaped negative differential resistance (N-NDR) [39,40] that, within a relatively narrow current range, is manifested by potential oscillations during chronopotentiometric measurements. The plot shows seven regular potential oscillations that are attributed to sequential formation of the stable Imep-Cu(I)-MPS suppressor film and its partial dissolution (deactivation) at the interface [29,30]. The intervals at higher overpotentials comprised between sharp potential steps correspond to an active Imep-Cu(I)-MPS diffusional barrier being operative at the interface.…”
Section: Resultsmentioning
confidence: 99%
“…The H2O-Cu(I)-MPS complex is a byproduct of the SPS which undergoes adsorptive dissociation on the Cu surface [29,30]. A combination of Cu(I) coordination coupled to inner-salt formation and inter-chain anion/cation pairing has been proven to be the chemical origin of the surfaceconfined precipitation of these suppressor/leveler adducts ( Fig.…”
Section: Resultsmentioning
confidence: 99%
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