2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2018
DOI: 10.1109/eurosime.2018.8369877
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BGA strip warpage induced by assembly process and the practical prediction methodology

Roseanne Duca
1
,
Jing En Luan
2
,
Phone Maw Hla
3
et al.
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Cited by 4 publications
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A Complete Explanation of Warpage Behavior Across Backend Processes on Organic BGA in Strip Form and its Predictive Methodology

Duca
1
,
Luan
2
,
Villa
3
et al. 2018
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
1
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A Complete Explanation of Warpage Behavior Across Backend Processes on Organic BGA in Strip Form and its Predictive Methodology

Duca
1
,
Luan
2
,
Villa
3
et al. 2018
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
1
0
0
0
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A Quick Methodology for Identifying Material Selection for Warpage Control in Backend

Duca
1
2019
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
3
0
0
0
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Virtual Design of Experiment Methodology for Package Design Robustness

Duca,
Cuzzocrea
2023
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
0
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