PurposeThis paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.Design/methodology/approachOf the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.FindingsResearch on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.Research limitations/implicationsBecause of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.Originality/valueThis review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

the bending fatigue life of electronic assembly. The solderIn this paper, four-point cyclic bend test was conducted for fatigue failure is the dominant failure mode when solder PBGA (Plastic Ball Grid Array) assembly with Sn-3.5Ag lead jointed electronic assembly subjected to cyclic bending load. free solder joint. Bending fatigue life of solder joint was Based on failure analysis, new solder ball layout design was recorded by measuring resistance of the designed daisy-chain presented to improve bending reliability. A series of finite for solder joints. Failure analysis was performed using dye element modeling and simulation were performed for fourpenetration and the critical solder joint location was observed. point cyclic bending reliability test. The parametric studies Then, comprehensive finite element modeling and simulation included: solder material constitutive model, loading profile of were conducted, including the effect of solder material triangle curve and sinusoidal curve, constraint boundary vs. constitutive model, triangular and sinusoidal loading profiles, contact boundary at the loading position, and new solder ball constraint vs. contact boundary, on simulation result. The layout design.

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