Bimaterial curvature measurements for the CTE of adhesives: optimization, modeling, and stability

Yu, Jang-Horng; Guo, Siming; Dillard, David A.

doi:10.1163/156856103762301970

Cited by 21 publications

(10 citation statements)

References 10 publications

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“…The coefficients of thermal expansion (CTEs) that lead to the stresses introduced in all these publications can be experimentally determined by dilatometry [25], using strain gauges, or using a bi-material curved beam method [26]. As shown in Table 1, the CTEs can differ between different types of adhesives and substrates and for some combinations lead to considerable expansion differentials.…”

Section: Differential Thermal Expansionmentioning

confidence: 99%

Adhesive Joints for Low- and High-Temperature Use: An Overview

Marques

Silva

Banea

et al. 2014

The Journal of Adhesion

159

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This work presents a review of several investigations on the topic of adhesive bonding at high and low temperatures. Durability and strength at extreme temperatures have always been a major limitation of adhesives that, given their polymeric nature, exhibit substantial degradation at temperatures where other structural materials (such as metals for example) have minute changes in mechanical properties. However, due to the inherent advantages of bonding, there is a large and continued effort aiming to improve the temperature resistance of adhesive joints, and this effort has been spread among the various topics that are discussed in this review. These topics include adhesive shrinkage and thermal expansion, adhesive properties, joint geometry optimization, and design techniques, among others. The findings of these research efforts have all found use in practical applications, helping to solve complex problems in a variety of high-tech industries where there is a constant need to produce light and strong components that can withstand large temperature gradients. Therefore, the final sections of this work include a discussion on two specific application areas that demonstrate the strict demands that extreme temperature use imposes on adhesive joints and the methods used to improve their performance.

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Section: Differential Thermal Expansionmentioning

confidence: 99%

Adhesive Joints for Low- and High-Temperature Use: An Overview

Marques

Silva

Banea

et al. 2014

The Journal of Adhesion

159

View full text Add to dashboard Cite

show abstract

“…G can be obtained by substituting (13) into (11). The complete solutions for G are not listed here due to space, but readers may obtain them easily by following the procedure described in this section.…”

Section: Energy Release Rate Of a Dcb Specimen Subjected To A Constanmentioning

confidence: 99%

“…Timoshenko ' and Pao [3]. Since interfacial residual stresses often dominate interfacial failure of multilayered materials and electronics packages, considerable attention has been devoted to the analysis of interfacial stresses [4][5][6][7][8][9][10][11][12]. Small deformation theory is adequate for determining the strain and stress fields for many applications, although a number of practical situations exist where large elastic deformations, i.e.…”

Section: Introductionmentioning

confidence: 99%

Effect of residual stress on the energy release rate of wedge and DCB test specimens

Guo

Dillard

Nairn

2006

International Journal of Adhesion and Adhesives

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“…Residual stresses can either be contractive or expansive in nature [19]. Contractive internal stresses typically develop due to cure shrinkage, physical aging and/or solvent loss during bond formation, which can lead to volume shrinkage and an accompanying tensile stress in the coating [21]. Contractive stresses in coatings can also arise due to the CTE mismatch between the substrate and coating.…”

Section: Residual Stresses and Thermal-hygroscopic Cyclingmentioning

confidence: 99%

“…Expressions similar to equation (1) for the compressive stress imposed by swelling due to an increase in temperature [23], or by an increase of the mass of absorbed fluid have also been developed. Residual stresses are often measured using bimaterial specimens [21,24,35]; however, this technique was not employed in this research.…”

Section: Residual Stresses and Thermal-hygroscopic Cyclingmentioning

confidence: 99%