35 words): An overview and comparison of different fabrication methods of black silicon is presented. Guidelines to optimize relevant parameters such as spatial frequencies and surface defect densities for optoelectronic applications such as photovoltaics will be given.
Summary:The potential of silicon surfaces structured in the micro-and nanometer regime are widely known, e.g. in photovoltaic (PV) crystalline silicon (c-Si) solar cells [1][2], watersplitting by photo-electrochemical-catalysis (PEC) [3], phododiods [4], terahertz emitters[5], highly sensitive optical[6] and chemical detection devices [7], amongst many others. Black silicon offers extraordinary and broadband antireflection properties [8]. Additionally, strong randomizing light-trapping is achieved for weakly absorbed photons close to the band edge of c-Si, i.e. light trapping [9]. The enlarged area for 3-D structured p/n-junctions might be advantageous for charge carrier separation. But due to the strongly enlarged surface and a usually high surface defect density black silicon nanostructures exhibit rather low electronic surface quality leading to strong surface recombination. This drawback limits the performance of potential devices [10], [11]. Therefore, effective surface passivation is essential for nanostructured silicon and investigations to find a well suited passivation scheme are going on ever since b-Si has been used for electro-optical devices. In this work, different black silicon fabrication methods are compared. Investigated are the resulting morphologies, as well as optical and electronic properties. Different groups working on black silicon have cooperated for this study. As benchmark parameters, we used the optical absorption and the minority carrier lifetime after the passivation of the samples with thermal-atomic layer deposited Al2O3 [12]. The differences of the obtained black silicon samples fabricated by different proceesses, such as plasma etching, chemical etching or laser processing, are discussed. Based on our findings, we will give guidelines to optimize the relevant physical parameters, e.g. the spatial frequencies and the surface defect densities for optoelectronic applications. PTu2C.2.pdf