2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 2014
DOI: 10.1109/ectc.2014.6897398
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Board level reliability and surface mount assembly of 0.35mm and 0.3mm pitch wafer level packages

Beth Keser
1
,
Rey Alvarado
2
,
Alan Choi
3
et al.
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