Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Singh, Bhupender; Menezes, Gary; McCann, Scott; Jayaram, Vidya; Ray, Urmi; Pulugurtha, Raj; Smet, Vanessa; Tummala, Rao

doi:10.1109/tcpmt.2017.2684464

Cited by 33 publications

(9 citation statements)

References 17 publications

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“…Figure 1b shows the barrel-type solder joint used in the BGA electronic device. The solder joint volume which is proportional to its mid-, top-radius, and height is considered as a parameter in the reliability assessment of the solder joint in the BGA components as reported in [21], [29], [30]. eleven different solder joint volumes, namely from 3.3mm 3 to 6.0mm 3 ({3.3, 3.6, 3.9, 4.2, 4.5, 4.8, 5.1, 5.4, 5.7, 6.0}), were considered for FE simulations.…”

Section: A Finite Element Simulationsmentioning

confidence: 99%

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

et al. 2022

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Rapid and precise reliability evaluation of electronic circuits plays a key role in the design stage of the electronic systems. The task becomes even more difficult when several major parameters contribute into the reliability evaluation. This paper proposes a neural network aided approach as a prediction tool for estimating the useful lifetime of the ball shaped solder joint as the most resistless part under accidental drops in the electronic devices. Several contributory factors including ball grid array (BGA) chip location, printed circuit board (PCB) thickness, solder alloy composition and solder ball volume are considered in our proposed rapid prediction model and their effects are investigated. 480 finite element simulations as well as 20 experimental tests are performed to obtain an enriched database for our neural network based prediction model. The accuracy of the proposed model is calculated as 97.55% in comparison with the finite element and the experimental results. Ability of considering multi contributory factors in the reliability evaluation of the BGA chip makes our proposed approach be a suitable candidate in design for reliability of the electronic systems.INDEX TERMS Solder joint, drop test, lifetime estimation, machine learning.

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Section: A Finite Element Simulationsmentioning

confidence: 99%

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

et al. 2022

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“…The failure of solder joints is influenced not only by the temperature and humidity environment changes in the electronic devices but also by dust, stress, shock, and vibration. The board level drop test, which is based on the mechanical shock test (refer to the standards of JEDEC JESD 22-B110 and JESD22-B111A), is an essential method for determining the mechanical reliability of solder joints [23][24][25]. Previous studies have focused on the mechanical reliability of Sn-Ag-Cu solder joints due to their wide use in SMT.…”

Section: Introductionmentioning

confidence: 99%

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

Liu

Xue

et al. 2022

Crystals

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The Sn–Bi solder paste is commonly used in electronic assembly and packaging, but its brittleness causes poor reliability in shock environments. In this study, the mechanical reliability of Sn–Bi solder paste and Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was investigated with the board level drop test. The crack characterizations of solder joints were evaluated using a stereomicroscope after the dye and pull test. The microstructure characterization and failure types of solder joints were analyzed by a scanning electron microscope (SEM), and an energy dispersive spectrometer (EDS) was employed to investigate the initial phase identification and elemental analysis. Compared with Sn–Bi solder paste, the results show that the TSEP Sn–Bi solder pastes reduced the proportion of the complete failure and partial failure of the solder joints during the drop test. The microstructure observation of the crack path showed that the Sn–Bi/TSEP Sn–Bi solder joints were reinforced through the cured epoxy resin. The number of drops of the Sn–Bi/TSEP Sn–Bi-x (x = 3, 5, 7) solder joints had 1.55, 2.57, and over 3.00 times that of Sn–Bi/Sn–Bi solder joints after the board level drop test.

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“…In addition to the above-mentioned literature, the effects of isothermal aging on the mechanical properties and useful lifetimes of solder interconnections have been examined by numerous accelerated experiments including thermal cycling, random vibration loading, shear fatigue, drop testing, etc. (Singh et al , 2017; Dalton et al , 2018; Ghaderi et al , 2018; Samavatian et al , 2018; Surendar et al , 2018; Al Athamneh et al , 2020; Elakkiya et al , 2020). A microstructural model was modified to characterize the thermal aging impacts on the creep behavior of Sn-Ag-Cu-based solder alloys (Mukherjee et al , 2016).…”

Section: Introductionmentioning

confidence: 99%

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Siswanto

Borodin

Mahmoud

et al. 2021

SSMT

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Purpose The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model. Design/methodology/approach Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed. Findings It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration. Originality value It is confirmed.

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Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Cited by 33 publications

References 17 publications

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

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