Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder

Chen, Ching-I; Ni, Ching-Yu; Chang, Chih‐Wen; Wu, S.C.; Liu, De‐Shin

doi:10.1109/tepm.2008.2002025

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Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder

Cited by 8 publications

References 6 publications

Low temperature chip on film bonding technology for 20 µm pitch applications

Low temperature chip on film bonding technology for 20 µm pitch applications

Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste

A new ESD model induced yield loss during chip-on-film package process and it's failure mechanism

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