2021
DOI: 10.3390/coatings11050600
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Bonding and Thermal-Mechanical Property of Gradient NiCoCrAlY/YSZ Thermal Barrier Coatings with Millimeter Level Thickness

Abstract: The thermal insulation properties of thermal barrier coatings (TBCs) can be significantly improved with increasing the coating thickness. However, due to the weak bonding of high-thickness TBCs, the resulting low reliability and short lifetime greatly limits their application under some severe operating conditions. In this study, a novel and high-efficiency synchronous dual powder feeding method is used to deposit a series of gradient NiCoCrAlY/YSZ coatings with millimeter level thickness. The tensile bonding … Show more

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Cited by 6 publications
(3 citation statements)
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“…Thermal conductivity is also analyzed to determine the thermal load of a material. Normally, thicker samples have a lower thermal conductivity due to an increase in their thermal resistance, a phenomenon that was already reported in previous studies [44,45]. However, in our study, even though the S5and S7-encoded samples are thicker than the S1-encoded sample, they have higher thermal conductivity values.…”
Section: Discussionsupporting
confidence: 75%
“…Thermal conductivity is also analyzed to determine the thermal load of a material. Normally, thicker samples have a lower thermal conductivity due to an increase in their thermal resistance, a phenomenon that was already reported in previous studies [44,45]. However, in our study, even though the S5and S7-encoded samples are thicker than the S1-encoded sample, they have higher thermal conductivity values.…”
Section: Discussionsupporting
confidence: 75%
“…The quenching stress and cooling stress increase with the coating thickness, which promotes the initiation and propagation of microcracks to lead to the decrease of the bonding strength after the tensile test. 37 39 From the importance ranking of the descriptors by SHAP, it can be concluded that the quenching stress and cooling stress that increase with the coating thickness are the most important factors leading to the decrease of the bonding strength compared to the impact of other factors.…”
Section: Resultsmentioning
confidence: 99%
“…The quenching stress is derived from the rapid formation of the layered structure during the deposition process, while the cooling stress comes from the mismatch of the thermal expansion coefficient of the coating and the substrate. The quenching stress and cooling stress increase with the coating thickness, which promotes the initiation and propagation of microcracks to lead to the decrease of the bonding strength after the tensile test. From the importance ranking of the descriptors by SHAP, it can be concluded that the quenching stress and cooling stress that increase with the coating thickness are the most important factors leading to the decrease of the bonding strength compared to the impact of other factors.…”
Section: Resultsmentioning
confidence: 99%