Bonding of silicon scanning mirror having vertical comb fingers

Lee, Jinho; Ko, Young-Chul; Choi, Byung-Soon; Kim, Jong Min; Jeon, Duk Young

doi:10.1088/0960-1317/12/5/320

Cited by 22 publications

(11 citation statements)

References 8 publications

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“…The typical measured load-deflection relation of the torsional micromirror is depicted in figure 10(a). This demonstrates that the torsional micromirror has an optical scanning angle near 5 • when driven at 90 V. Various optical scanners driven by the VCA have been reported in [4,[21][22][23][24][25]. By way of comparison with a typical scanner fabricated using a SOI wafer [22], the optical scanning angle was near 4 • when driven at 80 V. Note that no side-sticking phenomenon was observed during the driving test.…”

Section: Applicationsmentioning

confidence: 66%

The BELST II process for a silicon high-aspect-ratio micromaching vertical comb actuator and its applications

Tsai¹,

Chu²,

Hsieh³

et al. 2003

J. Micromech. Microeng.

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The BELST process has been proposed and it has demonstrated the capability to overcome anchoring and depth controlling issues in many high-aspect-ratio micromaching (HARM) processes. However, the actuation mechanisms are still restricted to in-plane motion only. In this study, a novel fabrication process called BELST II has successfully been developed. Moreover, the BELST II process was employed to fabricate a novel electrostatic vertical comb actuator (VCA). Three advantages for this VCA can be observed. First, through some exquisite designs the fabrication process has no critical alignment and bonding problems. Secondly, the relative vertical position between the moving and the stationary fingers can be adjusted freely to optimize the performance of the VCA. Thirdly, both a large mirror structure and trimmed torsional spring are available through this process. Thus, improved performance regarding enlarged traveling distance with reduced driving voltage can be obtained. In the application of the BELST II process, various HARM devices were realized, such as an optical scanner mirror and variable optical attenuator driven by the VCA.

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Section: Applicationsmentioning

confidence: 66%

The BELST II process for a silicon high-aspect-ratio micromaching vertical comb actuator and its applications

Tsai¹,

Chu²,

Hsieh³

et al. 2003

J. Micromech. Microeng.

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show abstract

“…It is considered that the Cr layer adhesion force between the Au layer and glass substrate would be decreased by the oxidization of the Cr layer during the anodic bonding process. The damage of the CPW ground, caused by bonding can be prevented by annealing the glass substrate before the anodic bonding process [16].…”

Section: Resultsmentioning

confidence: 99%

A 50–100 GHz ohmic contact SPDT RF MEMS silicon switch with dual axis movement

Sim

Lee

Jang

et al. 2016

Microelectronic Engineering

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We firstly show the prototype of an ohmic contact Single-Pole Double-Throw Radio Frequency Micro-Electro-Mechanical Systems (SPDT RF MEMS) switch operating at 50-100 GHz. The fabricated ohmic contact SPDT RF MEMS silicon switch moves both laterally and vertically, to improve the isolation at high frequencies by initially misaligning the contact part of the switch over a Coplanar Waveguide (CPW) transmission line. The lateral and vertical movement of the switch is operated by using comb and parallel plate actuators, respectively. The proposed switch was fabricated using Silicon-On-Glass (SiOG) bonding process. The insertion loss of the fabricated switch is measured according to the different operation states of the switch, in the range from 50 to 100 GHz. The fabricated length of the transmission line is 4.6 mm and the measured insertion loss and isolation are 9.13 dB and 24.37 dB at 70 GHz, respectively. Keyword 2 RF MEMS switch; high isolation; dual axis movement; silicon switch

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“…Although SOI substrate is easily named for this purpose, batch-fabricated sliders on SOI could not be isolated due to suspected electrical leakage in our experiments. Promising isolation method combining anodic bonding, DRIE and parylene-coating is presented to overcome the problem (7) (8) . Fig.…”

Section: Batch Fabrication Of Slidersmentioning

confidence: 99%

Electrostatically Controlled Linear Inchworm Actuator for Precise Step and Parallel Motion

et al. 2006

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This paper describes electrostatically controlled linear inchworm actuator (hereafter ECLIA). Besides accuracy, large stroke motion and high throughput become important to improve positioning efficiency. ECLIA can drive its sliders in parallel with high accuracy and large stroke. ECLIA works based on the inchworm motion controlled by the electrostatic clutch mechanism. The electrostatic clutch mechanism can control a transmission of motion from an oscillator to sliders. ECLIA can provide precise motion due to a piezoactuation of the oscillator and large stroke through an electrostatically controlled inchworm motion. ECLIA is developed by MEMS technology in this study. MEMS technology provides multi sliders in batch by taking an advantage of IC fabrication process. The electrostatic clutch method makes it possible to control parallel motions of multi sliders. Fig. 1 shows a schematic drawing of a typical ECLIA. Seven sliders are shown in Fig. 1. Suppose that multi sliders move independently with the aim of accomplishing their desired tracking motions.The system consists of a driving system and a slider system as shown in Fig. 1. The driving system is composed of a piezoactuator and an electrostatic clutch system. The electrostatic clutch system of the driving system has two electrodes: 1) Holding-electrode fixed on the substrate; 2) Movable driving-electrode. Fig. 2 explains motion principle of the system. A case for a forward motion of a slider is represented here. A chart of control signals corresponding to forward, backward, still or stop motion is shown in Fig. 3. The electrostatic clutch motion is synchronized with the piezoactuation through a combination of two electrodes so as to accumulate the piezoactuation step by step. Sliders are insulated each other controlled independently depending on tis electrical potential. Each sliders travels Fig. 1. Schematic drawing of a typical ECLIA forward, backward, and stops by control signals. MEMS technology is used to fabricate ECLIA. DRIE of Si following anodic bonding can provide islanded Si sliders. Parylene C coating on the surface of Si sliders guarantees insulation of adjacent sliders. In the last step, Au film is deposited on the tip of sliders to form mirror surfaces. Fabrication results of isolated sliders are shown in Fig. 3. 16 sliders bonded on a glass substrate are shown in Fig. 3. A slider is 9 mm long and 600 µm wide. 200 nm step was achieved when 50 V was applied to the piezoelectric oscillator. Isolated sliders could move independently as desinged.Optical application of ECLIA is ongoing toward high resolution dynamic gain equalizer as WDM spectral attenuator. Fig. 2. Motion Principle (Cross-section) Fig. 3. Developed ECLIA with 16 sliders -9 -This paper presents electrostatically controlled linear inchworm actuator for precise step and parallel motion. Electrostatically controlled linear inchworm actuator can provide a high accuracy (nm order), a large stroke (mm order) and parallel motion of multi sliders. Micro electro mechanical systems technology ...

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Bonding of silicon scanning mirror having vertical comb fingers

Cited by 22 publications

References 8 publications

The BELST II process for a silicon high-aspect-ratio micromaching vertical comb actuator and its applications

The BELST II process for a silicon high-aspect-ratio micromaching vertical comb actuator and its applications

A 50–100 GHz ohmic contact SPDT RF MEMS silicon switch with dual axis movement

Electrostatically Controlled Linear Inchworm Actuator for Precise Step and Parallel Motion

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