Bonding technology based on solid porous Ag for large area chips

Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging

“…16 The sintered nanocopper paste also has the same problems as its silver counterparts. 17,18 For other kinds of TIMs, such as the thermal gel (2−5 W m −1 K −1 ), thermally conductive adhesive (1−2 W m −1 K −1 ), thermal grease (0.4−4 W m −1 K −1 ), thermal pad (0.8−3 W m −1 K −1 ), and phase change materials (0.7−1.5 W m −1 K −1 ), they can provide several orders of magnitude lower Young's modulus, while their thermal conductivities are still far away from the standard of high power density chip package application. 10 Carbon-based materials such as vertically aligned carbon nanotubes (VACNTs) and graphene are intrinsically highly thermally conductive and thus show enormous potential as TIMs.…”

“…Though some literature studies have reported the pressureless sintering technology, it has only been demonstrated on small dies (<25 mm 2 ) and the shear strength is drastically lower than that of pressure sintering . The sintered nanocopper paste also has the same problems as its silver counterparts. , For other kinds of TIMs, such as the thermal gel (2–5 W m –1 K –1 ), thermally conductive adhesive (1–2 W m –1 K –1 ), thermal grease (0.4–4 W m –1 K –1 ), thermal pad (0.8–3 W m –1 K –1 ), and phase change materials (0.7–1.5 W m –1 K –1 ), they can provide several orders of magnitude lower Young’s modulus, while their thermal conductivities are still far away from the standard of high power density chip package application . Carbon-based materials such as vertically aligned carbon nanotubes (VACNTs) and graphene are intrinsically highly thermally conductive and thus show enormous potential as TIMs. − A recently reported honeycomb panel-like graphene pad even shows a metal-level through-plane thermal conductivity of more than 100 W m –1 K –1 .…”

A Rapid Bonding Method for Fabricating Mixing Microfluidic Chip Based on Micromachining Technology

“…Remarkably, due to its excellent performance, the mixing microfluidic chip has applications in such fields as biological analysis and chemical detection [6]. Furthermore, in order to obtain the chips with different substrates, the technologies including channel fabricating [7] and chip bonding [8] are investigated.…”

Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding

“…Thermal compression bonding in particular is a common method used to drive direct bonding, with the aid of increased temperatures and pressure to bond separate metals [5]. Many studies have reported successful direct bonding of various high-conductivity materials such as copper [6,7], silver [8,9,10], and gold [11,12]. However, each material faces unique challenges and difficulties based on its inherent qualities.…”