“…However, its crystallization into a compact layer requires a high temperature (400-500 °C) [22,23], which is not compatible with certain PSC configurations (p-i-n) or with flexible plastic-based substrates (kapton, polyethylene terephthalate (PET), poly-ethylene naphthalate (PEN)). To overcome these issues, various approaches have been developed for fabricating compact TiO 2 coatings for PSCs, such as sputtering process [24,25], which showed power conversion efficiencies (PCEs) of 16.1% and 23% on glass substrates; electron beam evaporation [26], demonstrating 11.6%; and solution treatment methods, involving a lower temperature of 150 • C, which resulted in a PCE of 13.5% [27]. In contrast to these techniques, the PC of TiO 2 is promising mainly because of its compatibility with R2R and sensitive substrates (PEN, PET) [28], Additionally, its reduced process time and low thermal budgets [29] make it appealing for large-scale industry.…”