2012
DOI: 10.1155/2012/902849
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Bottom-Up Abstract Modelling of Optical Networks-on-Chip: From Physical to Architectural Layer

Abstract: This work presents a bottom-up abstraction procedure based on the design-flow FDTD + SystemC suitable for the modelling of optical Networks-on-Chip. In this procedure, a complex network is decomposed into elementary switching elements whose input-output behavior is described by means of scattering parameters models. The parameters of each elementary block are then determined through 2D-FDTD simulation, and the resulting analytical models are exported within functional blocks in SystemC environment. The inheren… Show more

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Cited by 3 publications
(3 citation statements)
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“…Therefore, Simulink simulation framework was adopted for the evaluation of quality metrics of optical NoC physical layouts studied in this thesis. Finally, this chapter has included contents that are referred to a cooperative and interdisciplinary work where further details are in [40].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Therefore, Simulink simulation framework was adopted for the evaluation of quality metrics of optical NoC physical layouts studied in this thesis. Finally, this chapter has included contents that are referred to a cooperative and interdisciplinary work where further details are in [40].…”
Section: Resultsmentioning
confidence: 99%
“…Without lack of generality, we refer to microring-based 1x2 PSE. In the case of ring-based ONoCs, the 1x2 PSE can be implemented via a microring resonator cascaded to a crossing between two orthogonal waveguides (see Figure. A microring resonator and a crossing between two waveguides (network α and β in Figure. Details about s-matrices along with the analytical model are well described in [40]. Simulation approach has been used, and the 1x2 PSE has been charac- …”
Section: S-parameters Modelling Of a 1x2 Psementioning
confidence: 99%
“…Over the last several decades, photonic communication networks have emerged as the most promising approach to massively expand the bandwidth and reduce power consumption relative to conventional metal-based electrical communication networks. However, the increasing number of waveguide crossings causes optical loss and limits the scalability of the existing in-plane networks. To resolve this issue, multilayered three-dimensional (3D) networks can provide efficient topologies and increase the density of integrated functional elements, which in conjunction can reduce energy requirements. …”
Section: Introductionmentioning
confidence: 99%