Brazing copper and alumina metallized with Ti-containing Sn0.3Ag0.7Cu metal powder

Wang, Fu; Song, Xiaoguo; Hu, Shengpeng; Chai, J.H.; Feng, Jicai; Wang, G.D.

doi:10.1016/j.matdes.2015.08.081

Cited by 42 publications

(7 citation statements)

References 26 publications

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“…On the other hand, most metals are soft, ductile with better fracture toughness and have less strength compared to ceramics [2]. To combine the functional properties of ceramics and make up for its brittleness and low fracture toughness, it is required to join them with metals which require application in industries like electronics, electrical and especially in microelectronics packaging [3]. A welding/brazing process requires that base metals to arrange in a stable configuration which results in interatomic or intermolecular forces between the different joining atoms under the application of heat and pressure [4] Theoretically, it is impossible to bond metals and ceramics because of their inherent different electronic structures and bonding type i.e.…”

Section: Introductionmentioning

confidence: 99%

Recent Advances in Active Metal Brazing of Ceramics and Process

et al. 2019

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Ceramic to metal joining has its potential applications in microelectronics packaging, metal-ceramic seals, vacuum tubes, sapphire metal windows, etc. But there are many limitations in joining this duo of materials that range from their structures, nature of bonding, physical properties to a complex phenomenon like wetting, spreading and adhesion. The current review discusses these critical issues from the aspects of thermodynamics, the role, and type of active elements, Ag-Cu-Ti brazing filler system and the reliability factors like residual stress, coefficient of thermal expansion, material reliability, pores and unbonded regions on the surface which affect the mechanical reliability of the joint.

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Section: Introductionmentioning

confidence: 99%

Recent Advances in Active Metal Brazing of Ceramics and Process

et al. 2019

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“…It has been widely reported that alumina could be brazed to different metals with Ti-containing filler alloys [10,21,[32][33][34][35][36][37]. The types of titanium oxides that form in an Al 2 O 3 /Kovar joint using Ag-Pd/Ti filler are found to be affected by the thickness of the Ti layer, and the joint strengths are influenced by the thicknesses of the reaction layer and residual Ti layer [32].…”

Section: Introductionmentioning

confidence: 99%

Microstructure Evolution and Mechanical Properties of Titanium/Alumina Brazed Joints for Medical Implants

Bian

Song

et al. 2019

Metals

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Medical titanium and alumina (Al2O3) bioceramic are widely utilized as biomaterials. A reliable brazed joint of titanium and alumina was successfully obtained using biocompatible Au foil for implantable devices in the present study. The interfacial microstructure and reaction products of titanium/Au/Al2O3 joints brazed under different conditions were investigated by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD). In this study, the typical interfacial microstructure of the titanium/Au/Al2O3 joint was titanium/Ti3Au layer/TiAu layer/TiAu2 layer/TiAu4 layer/Au + granular TiAu4 layer/TiOx phase/Al2O3 ceramic. With increasing brazing temperature or holding time, the thicknesses of Ti3Au + TiAu + TiAu2 layers adjacent to the titanium substrate increased gradually. Shear tests indicated that the joint brazed at 1115 °C for 3 min exhibited the highest shear strength of 39.2 MPa. Typical fracture analysis displayed that the crack started at the Al2O3 ceramic and propagated along the interface of TiAu2 and TiAu4 reaction layers.

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“…Direct bonding of copper to alumina has been developed by an eutectic reaction of copper and cuprous oxide at 1050 • C [8]. Fu et al used titanium with Sn 0.3 Ag 0.7 Cu to bond copper and alumina at 620 • C [9]. The predictability and strength have been enhanced, based on low active energy, to form a good junction, suppressed intermetallics [10,11], and residual stress [12,13].…”

Section: Introductionmentioning

confidence: 99%

A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Huang

Chen

et al. 2018

Coatings

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Ceramic-to-metal heterojunctions have been established to improve high-temperature stability for applications in aerospace and harsh environments. In this work, we employed low-temperature diffusion bonding to realize an alumina/Cu heterogeneous joint. Using a thin layer of lanthanum-doped titanium (La-doped Ti) to metallize the alumina surface, we achieved the bonding at a temperature range of 250–350 °C. We produced a uniform, thermally stable, and high-strength alumina/Cu joint after a hot-press process in vacuum. Signals from X-ray diffraction (XRD) suggested the successful diffusion of Ti and La into the alumina substrate, as Ti can easily substitute Al in alumina, and La has a better oxygen affinity than that of Al. The transmission electron microscopy and XRD results also showed the existence of CuxTiyO phases without CuxTiy or LaOx. In addition, the bonding strength of alumina/copper hot-pressed at 250, 300, and 350 °C were 7.5, 9.8 and 15.0 MPa, respectively. The process developed in this study successfully lowered the bonding temperature for the alumina/copper joint.

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Brazing copper and alumina metallized with Ti-containing Sn0.3Ag0.7Cu metal powder

Cited by 42 publications

References 26 publications

Recent Advances in Active Metal Brazing of Ceramics and Process

Recent Advances in Active Metal Brazing of Ceramics and Process

Microstructure Evolution and Mechanical Properties of Titanium/Alumina Brazed Joints for Medical Implants

A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

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