2020
DOI: 10.1016/j.ceramint.2020.01.014
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Brazing of ZrB2–SiC–C and GH99 with AgCuTi/SiC interpenetrating network structural composite as an interlayer

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Cited by 16 publications
(5 citation statements)
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“…At the same time, the B 4 C particle also consumed too much active Ti element, the reaction between Ti and SiC base material to form a reaction diffusion layer was hindered. 6,31,32 The shear strength of brazed joints with different B 4 C additions confirmed this analysis, as shown in Figure 11.…”
Section: Effect Of the Amount Of B 4 C On The Microstructure Evolutio...supporting
confidence: 67%
See 1 more Smart Citation
“…At the same time, the B 4 C particle also consumed too much active Ti element, the reaction between Ti and SiC base material to form a reaction diffusion layer was hindered. 6,31,32 The shear strength of brazed joints with different B 4 C additions confirmed this analysis, as shown in Figure 11.…”
Section: Effect Of the Amount Of B 4 C On The Microstructure Evolutio...supporting
confidence: 67%
“…When the content of B 4 C was too high, it tended to form small blocks (the aggregated B 4 C as shown in Figure 10), which affected the fluidity of the alloy, split the solid solution with good plasticity, resulted in the more complex stress situation in the joint. At the same time, the B 4 C particle also consumed too much active Ti element, the reaction between Ti and SiC base material to form a reaction diffusion layer was hindered 6,31,32 . The shear strength of brazed joints with different B 4 C additions confirmed this analysis, as shown in Figure 11.…”
Section: Resultsmentioning
confidence: 58%
“…The metallized layer, formed by the reaction of Ag‐Cu‐Ti and SiC, has an important effect on the properties of the joint 27 . The following equation occurs between Ti and SiC: 9,18,21,23,28,34,35 SiC+Ti=TiC+Si 5Ti+3Si=Tnormali5Snormali3 2TiC+Ti+Si=Tnormali3SinormalC2…”
Section: Resultsmentioning
confidence: 99%
“…The active elements or rare earth elements in the active solder react with the ceramic and form chemical bonds, which can effectively improve the wettability of solder on the ceramic surface. [ 7–10 ] Kolenak [ 11 ] wetted Al 2 O 3 ceramics with Sn2Ti active solder in a vacuum furnace at 700 °C. Due to the residual stress in Al 2 O 3 /Sn2Ti/steel, the shear strength was only 18.3 MPa.…”
Section: Introductionmentioning
confidence: 99%