2016
DOI: 10.1109/tdmr.2016.2584140
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Breakdown Analysis of Magnetic Flip-Flop With 28-nm UTBB FDSOI Technology

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Cited by 12 publications
(4 citation statements)
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“…The reliability of hybrid CMOS/magnetic integration is a major concern for circuit designers in the near future [43][44][45][46][47][48][49]. The integration of unreliable, deep-scaled nanometer CMOS and MTJ processes pose tremendous challenges from the device level up to system level.…”
Section: Discussionmentioning
confidence: 99%
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“…The reliability of hybrid CMOS/magnetic integration is a major concern for circuit designers in the near future [43][44][45][46][47][48][49]. The integration of unreliable, deep-scaled nanometer CMOS and MTJ processes pose tremendous challenges from the device level up to system level.…”
Section: Discussionmentioning
confidence: 99%
“…With the continuous scaling of CMOS technology nodes, MRAM with design-for-reliability is required due to the impacts of parametric process variations, aging mechanisms and transient faults [35,36,[45][46][47][48]. In this section, the process variation, thermal variation and breakdown are reviewed for reliable MRAM design.…”
Section: Reliability Issuesmentioning
confidence: 99%
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“…MTJ-based low power nonvolatile flip-flops [14], [18] are being used in the latest highperformance System on Chip (SoC) applications [22], [23]. Spin Transfer Torque (STT) based multi-bit nonvolatile flipflops [15], [19] are being used for non-volatile storage applications. Energy and area efficient SOT based Nonvolatile flip flop for power-gating [16] are employed in the latest SoC applications.…”
Section: Electrical Controlled Magnetic Tunnel Junction (Mtj)mentioning
confidence: 99%