Broadband Zero-Power Wakeup MEMS Device for Energy-Efficient Sensor Nodes

Ahmed, Minhaz; Dankwort, Torben; Grünzig, Sven; Lange, V.; Gojdka, Björn

doi:10.3390/mi13030407

Cited by 6 publications

(1 citation statement)

References 44 publications

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“…Finally, the wafers are cleaned of any unwanted powder residues and are ready for further processing under standard MEMS cleanroom conditions. In previous work, the use of PowderMEMS structures for energy harvesting and zero-powder wakeup [ 18 , 19 ], permanent micromagnets and magnetic position detection [ 20 , 21 ], and the creation of liquid-cooled microscale inductor cores [ 22 ] has been presented.…”

Section: Introductionmentioning

confidence: 99%

Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

2022

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Most current thermal MEMS use fragile structures such as thin-film membranes or microcantilevers for thermal isolation. To increase the robustness of these devices, solid thermal insulators that are compatible with MEMS cleanroom processing are needed. This work introduces a novel approach for microscale thermal isolation using porous microstructures created with the recently developed PowderMEMS wafer-level process. MEMS devices consisting of heaters on a thin-film membrane were modified with porous microstructures made from three different materials. A thermal model for the estimation of the resulting thermal conductivity was developed, and measurements for porous structures in ambient air and under vacuum were performed. The PowderMEMS process was successfully used to create microscale thermal insulators in silicon cavities at the wafer level. Measurements indicate thermal conductivities of close to 0.1 W/mK in ambient air and close to 0.04 W/mK for porous structures under vacuum for the best-performing material. The obtained thermal conductivities are lower than those reported for both glass and porous silicon, making PowderMEMS a very interesting alternative for solid microscale thermal isolation.

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Section: Introductionmentioning

confidence: 99%

Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

2022

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Exploring the Microcosm: A Comprehensive Survey of Micro Sensor Applications Across Multidisciplinary Research

Nandhini,

Radha

2024

Lecture Notes in Electrical Engineering

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Near-zero-power infrared relay based on microfluidic switch and metamaterial absorber

Zhang,

Yan,

Zhao

et al. 2023

Applied Physics Letters

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Internet of Things sensor nodes, which integrate information acquisition, processing, exchange, and execution modules, have widely been used for unattended industrial production, environmental monitoring, and other fields. However, limited battery power constrains the lifespan of the sensor nodes. In this paper, we propose a near-zero-power infrared relay consists of microfluidic switches and a metamaterial absorber (MA). When target appears, the MA absorbs the infrared energy emitted from the target and uses it to turn on the microfluidic switch. When valid information is not present, the microfluidic switch is in “off” state with a high resistance of over 109 Ω. The infrared relay with a pair of microfluidic switches shows common mode suppression capability against environmental temperature variation. We further demonstrate a sensor node consists of the infrared relay and a MoS2 photodetector. In a standby mode, the sensor node shows near-zero power consumption. As target infrared signal occurs, the photodetector is wakened by the infrared relay and illustrates excellent optical sensing performance. The simplicity of this approach provides a route for significantly extending the lifespan of sensor nodes powered by batteries, especially the sensor nodes for detecting infrequent but critical events.

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Broadband Zero-Power Wakeup MEMS Device for Energy-Efficient Sensor Nodes

Cited by 6 publications

References 44 publications

Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

Exploring the Microcosm: A Comprehensive Survey of Micro Sensor Applications Across Multidisciplinary Research

Near-zero-power infrared relay based on microfluidic switch and metamaterial absorber

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