2013
DOI: 10.1016/j.solmat.2012.09.013
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Broken metal fingers in silicon wafer solar cells and PV modules

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Cited by 74 publications
(32 citation statements)
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“…Intrinsic defects consist of grain boundaries and dislocations, which will decrease the photoelectric conversion efficiency. Extrinsic defects consist of microcracks, breaks, and finger interruptions, which will shorten lifetime, reduce efficiency, and make authentication fails of cells [3,4].…”
Section: Introductionmentioning
confidence: 99%
“…Intrinsic defects consist of grain boundaries and dislocations, which will decrease the photoelectric conversion efficiency. Extrinsic defects consist of microcracks, breaks, and finger interruptions, which will shorten lifetime, reduce efficiency, and make authentication fails of cells [3,4].…”
Section: Introductionmentioning
confidence: 99%
“…The second type of EL image change is DRs, as shown in Figure 4b. Chaturvedi et al [17] stated that broken MFs cause DRs in EL images due to the electrical disconnection effect that occurs in EL images. Broken MFs obstruct photovoltaic effects by blocking the electric current, eventually influencing the PV module efficiency and decreasing the productive area.…”
Section: Resultsmentioning
confidence: 99%
“…Hot spots are relatively frequent in current PV modules and this situation will likely persist as the PV module technology is evolving to thinner wafers, which are prone to developing micro-cracks during the manipulation process such as manufacturing, transportation, and installation [6][7][8].…”
Section: Introductionmentioning
confidence: 99%