Buckling instability and adhesion of carbon layers

Gille, G.; Rau, B.

doi:10.1016/0040-6090(84)90365-1

Cited by 170 publications

(61 citation statements)

References 5 publications

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“…The values for E and ␥ estimated here are successfully in the same order of magnitude reported before. 27,28 This pattern-formation technique could be used in microdevices, as the metal films are detached from substrates and locally formed well-shaped hermetic tunnels between the films and the substrates. When a laser beam scanned over an existed wavy wrinkle, the metal thin films can be constructed to trirouteway and quadrirouteway patterns (see EPAPS Ref.…”

Section: Fig 1 (Color)mentioning

confidence: 99%

Laser-induced wavy pattern formation in metal thin films

Xiao

Guan

Wang

et al. 2004

Applied Physics Letters

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Laser-induced well-ordered and controllable wavy patterns are constructed in the deposited metal thin film. The micrometer-sized structure and orientation of the wavy patterns can be controlled via scanning a different size of rectangle laser spot on the films. Ordered patterns such as aligned, crossed, and whirled wave structures were designed over large areas. This patterning technique may find applications in both exploring the reliability and mechanical properties of thin films, and fabricating microfluidic devices. There is much current interest in the induced micropattern formation technique for their potential applications in microdevices. [1][2][3][4][5] Various patterns with interesting morphologies such as hillocks, 6 straight blisters, 7 and wavy patterns, [8][9][10][11][12] have been reported formation in compressed thin film-resulted from the thermal-induced mechanism. Some of these morphologies, such as the wavy patterns, have been ubiquitously observed in many different film-substrate systems, including deposited metal, 13-15 covalent-ionic compounds, 16 and diamondlike carbon films 17-19 on Si, glass, and steel substrates, respectively, which hint at a certain universality of underlying mechanics. The complexity of the blister shapes and the patterns has both fascinated and befuddled investigators, especially when the experimental and theoretical knowledge of the detailed mechanism is still unclear and the patterns are still unpredictable and uncontrollable. [20][21][22][23][24][25][26] Here, a laser-induced micropattern technique is reported to realize the controllability and be very helpful to the explanation of this phenomenon.Controllable wavy pattern formation in thin films in this study is presented in a schematic diagram [Figs. 1(a)-1(d)]. Aluminum films with typical thickness of 300 nm were deposited onto a glass substrate by an ac magnetron sputtering technique. During sputtering deposition, the substrate temperature was kept at 120°C, and then the system was cooled down slowly to room temperature ͑25°C͒ [ Fig. 1(a)]. With that, a rectangular laser beam focused on the area of smooth surface [ Fig. 1(b)]. The instantaneous injection of the thermal flux separated the irradiated region of the film from the substrate immediately due to the abrupt thermal expansion of the film and the large elastic mismatch between the film and the substrate. Then the film, as shown schematically in Fig. 1(c), delaminated from the substrate and deformed into wrinkles right away through the release of the internal compressive stress. The formation of the wavy pattern in the delaminated region is due to the existence of the isotropic biaxial compression in the film [ Fig. 1(d)]. This phenomenon is very sensitive to the laser flux with a certain range of energy when the compressive stress existed in thin filmsubstrate combinations.The process of the wavy structure formation is recorded by the Figs. 1(e)-1(g). The laser pulse, with a pulse energy of 600 J / m 2 and a spot size of 12.5ϫ 7.5 m 2 , was applied on t...

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Section: Fig 1 (Color)mentioning

confidence: 99%

Laser-induced wavy pattern formation in metal thin films

Xiao

Guan

Wang

et al. 2004

Applied Physics Letters

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“…In Ref. [18] the buckling instability condition was utilized for quantitative characterization of the adhesion of a carbon ion beam deposited layer on a quartz substrate.…”

Section: E-mail Address: Afedorov@rugnl (Av Fedorov)mentioning

confidence: 99%

Degradation and recovery of adhesion properties of deformed metal–polymer interfaces studied by laser induced delamination

Федоров¹,

Tijum²,

Vellinga³

et al. 2007

Progress in Organic Coatings

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Degradation and recovery of adhesion properties of deformed metal-polymer interfaces studied by laser induced delamination Fedorov, A. V.; van Tijum, R.; Vellinga, W. -P.; De Hosson, J. Th. M. Take-down policy If you believe that this document breaches copyright please contact us providing details, and we will remove access to the work immediately and investigate your claim.Downloaded from the University of Groningen/UMCG research database (Pure): http://www.rug.nl/research/portal. For technical reasons the number of authors shown on this cover page is limited to 10 maximum. AbstractAdhesion properties of polymer coatings on metals are of great interest in various industrial applications, including packaging of food and drinks. Particular interest is focused on polymer-metal interfaces that are subjected to significant deformations during manufacturing process. In this work steel samples laminated with polyethylene terephthalate (PET) were subjected to uniaxial tensile deformations followed by annealing treatments. The measurements have demonstrated degradation of adhesion of the metal-polymer interface as the strain introduced by the deformation increased. Moreover, it was observed that within the geometry used in the experiments tensile deformations of the metal substrate introduced in-plane compressive stresses in the bulk of the coating. After applying a thermal treatment restoration of the adhesion has been achieved.Laser induced delamination technique was used to monitor the adhesion properties. In this technique a coating is subjected to a series of infrared laser pulses with a stepwise increase of intensity. Upon increasing the laser pulse intensity, the pressure which is formed inside the blisters reaches a critical value, resulting in further delamination of the coating. To process the experimental data an elastic model was developed. From the analysis of the experimental data the critical stresses required for the delamination and the practical work of adhesion are derived. The model accounts for the compressive in-plane stress present in the coating of the deformed samples.

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“…Phone cord delaminations have been reported in many different thin film systems with the presence of biaxial compressive residual stress [8][9][10][11][12]. Straight-sided buckling-driven delaminations were also observed, especially under the influence of uniaxial external stress [13][14][15][16].…”

Section: Discussionmentioning

confidence: 89%

Experiments with in-situ thin film telephone cord buckling delamination propagation

Volinsky

2002

MRS Proc.

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There are many different stress relief mechanisms observed in thin films. One of the mechanisms involves film debonding from the substrate. In the case of tensile residual stress a network of through-thickness cracks forms in the film. In the case of compressive residual stress thin film buckling and debonding from the substrate in the form of blisters is observed. The buckling delamination blisters can be either straight, or form periodic buckling patterns commonly known as telephone cord delamination morphology.The mechanics of straight-sided blisters is well understood. Current study relies on the insitu observation of phone cord delamination propagation in different thin film/substrate systems. Both straight and phone cord delaminations are shown to simultaneously propagate in the same film system. Straight-sided blisters propagate several times faster than the phone cords, and may be followed by thin film fracture along the line of maximum film buckling amplitude. Phone cord delaminations originally start as straight-sided blisters, but then deviate to the periodic phone cord geometry due to the fact that the compressive residual stress in the film is biaxial. Digital analysis of motion recordings shows that partial crack "healing" is present at the curved portions of the phone cords due to the "secondary" buckling pushing thin film back to the substrate. These experimental observations allow for the correct interpretation of the telephone cord delamination morphology.

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Buckling instability and adhesion of carbon layers

Cited by 170 publications

References 5 publications

Laser-induced wavy pattern formation in metal thin films

Laser-induced wavy pattern formation in metal thin films

Degradation and recovery of adhesion properties of deformed metal–polymer interfaces studied by laser induced delamination

Experiments with in-situ thin film telephone cord buckling delamination propagation

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