2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2019
DOI: 10.1109/ispsd.2019.8757646
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Building blocks for future dual-channel GaN gate drivers: Arbitrary waveform driver, bootstrap voltage supply, and level shifter

Abstract: Capitalising on the high-speed switching capability of 650 V GaN FETs in power-electronic bridgelegs is challenging. Whilst active gate driving has previously been shown to help overcome adverse switching behaviour, the best results are likely to be achieved through a combination of uncompromised circuit layout and active gate driving. A fully integrated dual-channel driver would minimise external circuitry and allow power devices to be placed as close together as possible. This would facilitate simultaneous m… Show more

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Cited by 10 publications
(2 citation statements)
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“…Such waveform shaping techniques, on the gate or switching nodes of the GaN-based circuit, have also been implemented in the E-mode GaN driver ICs. [81][82][83][84] The primary goal of current gate driver designs is to improve reliability and power conversion efficiency and to reduce EMI noise of the GaN power devices in practical applications. As a result, dynamic adjustments of the gate driving strength for safe and efficient switching with fast dead-time corrections are active research areas.…”
Section: Gan Power Modulesmentioning
confidence: 99%
“…Such waveform shaping techniques, on the gate or switching nodes of the GaN-based circuit, have also been implemented in the E-mode GaN driver ICs. [81][82][83][84] The primary goal of current gate driver designs is to improve reliability and power conversion efficiency and to reduce EMI noise of the GaN power devices in practical applications. As a result, dynamic adjustments of the gate driving strength for safe and efficient switching with fast dead-time corrections are active research areas.…”
Section: Gan Power Modulesmentioning
confidence: 99%
“…Switching times of wide bandgap power transistors are extremely high (hundreds of V/ns for 600V GaN or 1.2kV SiC MOSFET) [1]. Therefore, practical useful guidelines are provided to the designer to determine the best trade-off in terms of integrated high voltage capacitive dv/dt sensor (CS), current mirror gain and PMOS/NMOS transistors sizes in order to design an integrated dv/dt control system [2]- [4].…”
Section: Introductionmentioning
confidence: 99%