“…77 Furthermore, the densities of the 1-D (i.e., micropipe), two-dimensional (i.e., stacking fault), and three-dimensional 8 (i.e., polytype switch, carbon inclusion, and silicon droplet) defects in f-SiC have been drastically decreased to the negligible levels 6,9 by applying the FSGP method for the growth of f-SiC epilayers. Meanwhile, the source SiC material for FSGP is prepared via the modified physical vapor transport technique developed by Wellmann et al, 8,10,11 where the stable nitrogen doping and low dislocation densities in the source SiC material have been realized.…”