Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies

Ho, Cheng-Ying; Tsai, Meng‐Ting; Duh, Jenq‐Gong; Lee, Jyh-Wei

doi:10.1016/j.jallcom.2014.02.048

Cited by 12 publications

(6 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Lattice diffusion was deemed to be the dominant creep mechanism, since the creep exponents were closed to the theoretical exponents of lattice diffusion. The findings by Li et al [60] are in accordance with the bump height effect on solder hardening [44].…”

Section: Fracture and Creep Deformation Of Solder Jointssupporting

confidence: 64%

“…For example, for the bump size effect on solder hardening, the creep resistance and hardness of Sn3.0Ag0.5Cu and Sn3.5Ag solder joints are illustrated to be increasing with the decrease of bump height. Meanwhile, the secondary β-Sn dendrite arm length was found to be linear with respect to the logarithm of the bump height [44], as shown in Figure 7. Apart from the size effects on intrinsic mechanical properties of the solder matrix, local mechanical behavior of IMCs was also reported to be size-dependent.…”

Section: Size Effects On Mechanical Properties Of Solder Jointsmentioning

confidence: 92%

“…Sci. 2019,9, x FOR PEER REVIEW 8 of Eutectic structures and β-Sn dendrite phases in the Ni/Sn3.5Ag/Cu solder joints with different bump heights[44]. (Reused with permission).…”

mentioning

confidence: 99%

See 2 more Smart Citations

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

View full text Add to dashboard Cite

With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great concern for the reliability of different sizes of solder interconnections. In this paper, the effect of solder size on the microstructure (i.e., interfacial intermetallic compound (IMC) growth, precipitation in the solder matrix, dendrite arms, and undercooling) and mechanical properties (i.e., tensile property, shear and compression strength, fracture toughness, and creep deformation) are reviewed from the mechanical point of view. In addition, some areas for further researches about size effects on solder joints are discussed.

show abstract

Section: Fracture and Creep Deformation Of Solder Jointssupporting

confidence: 64%

Section: Size Effects On Mechanical Properties Of Solder Jointsmentioning

confidence: 92%

See 1 more Smart Citation

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

View full text Add to dashboard Cite

show abstract

“…It was found that the added TiO 2 favoured higher hardness values and increased the IMC formation near the joint interfaces. A similar approach was used by Roh et al (2014), Ho et al (2014) and Yang et al (2015), which indicated that the load-control configuration was also preferable in evaluating the hardness of the IMC phases subjected to grain refinement.…”

Section: Evaluation Of Intermetallic Compoundsmentioning

confidence: 99%

Hardness testing of lead-free solders: a review

Yahaya

Mohamad

2017

SSMT

View full text Add to dashboard Cite

Purpose This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and discussed accordingly to each of the measurement techniques: Vickers microhardness, Brinell microhardness and nanoindentation. Design/methodology/approach A brief introduction on lead-free solders and the concept of hardness testing has been described at the beginning of the review. Equipment setup, capabilities, test configuration and outcomes were presented for each technique and discussed in parallel along with the case studies from selected articles. Findings Comparison, outcomes and insight regarding each of the methods were highlighted to observe the recent trends, scientific challenges, limitations and probable breakthroughs of the particular hardness testing methods. Originality/value The compilation of latest reports, technical setup plus with the critics and perception from the authors are the main key value in this review. This provides an in-depth understanding and guidance for conducting hardness evaluation on lead-free solders.

show abstract

“…In the meantime, interconnects bonding reliability prediction is of great interest to many areas of power electronics. It is widely accepted that the interfacial reaction layers at solder/substrate interfaces are crucial for the reliability of power electronics, which demands fundamental understanding on their formation and evolution mechanism [7,8]. Conventionally, works have been carried out on the fixed state of the solder joints under different thermal conditions, followed by subsequent examination using scanning electron microscopy (SEM) or transmission electron microscopy (TEM) techniques [9,10], i.e.…”

Section: Introductionmentioning

confidence: 99%

Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

Zhou

Liu

2018

2018 7th Electronic System-Integration Technology Conference (ESTC)

View full text Add to dashboard Cite

The present investigation aimed to use in-situ heating experiment in a transmission electron microscope (TEM) to live characterize the thermal stability of a Cu/Ni-W-P interlayer/ZnAl solder interconnect. It demonstrated the TEM was able to detect live intermetallic compounds (IMCs) growth during heating. In addition, stress building up was evidenced by the progressive evolving of the dislocations at the interface between Ni-W-P interlayer and the ZnAl Solder. However, due to the µm to nm scale of specimens' dimensions required for electron microscopy, the sample preparation and data interpretation remains a challenge.

show abstract

Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies

Cited by 12 publications

References 18 publications

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Hardness testing of lead-free solders: a review

Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

Contact Info

Product

Resources

About