2023
DOI: 10.1021/acsphotonics.3c00834
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C- and O-Band Dual-Polarization Fiber-to-Chip Grating Couplers for Silicon Nitride Photonics

Manuel Kohli,
Daniel Chelladurai,
Boris Vukovic
et al.

Abstract: Highly efficient coupling of light from an optical fiber to silicon nitride (SiN) photonic integrated circuits (PICs) is experimentally demonstrated with simple and fabrication-tolerant grating couplers (GC). Fully etched amorphous silicon gratings are formed on top of foundry-produced SiN PICs in a back-end-of-theline (BEOL) process, which is compatible with 248 nm deep UV lithography. Metallic back reflectors are introduced to enhance the coupling efficiency (CE) from −1.11 to −0.44 dB in simulation and from… Show more

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Cited by 11 publications
(11 citation statements)
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“…Recently, hybrid grating couplers with multi-layer configurations have emerged as promising candidates for efficient optical coupling, leveraging advanced fabrication processes applied to the chip's frontside [44][45][46][47][48][49][50][51][52][53][54][55][56]. Compared to a rather complex backside chip processing, implementing new material layers on the chip's frontside is advantageous as it provides an additional degree of freedom to improve the photonic chip functionalities and can be more readily integrated into a standard chip-scale fabrication process.…”
Section: Introductionmentioning
confidence: 99%
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“…Recently, hybrid grating couplers with multi-layer configurations have emerged as promising candidates for efficient optical coupling, leveraging advanced fabrication processes applied to the chip's frontside [44][45][46][47][48][49][50][51][52][53][54][55][56]. Compared to a rather complex backside chip processing, implementing new material layers on the chip's frontside is advantageous as it provides an additional degree of freedom to improve the photonic chip functionalities and can be more readily integrated into a standard chip-scale fabrication process.…”
Section: Introductionmentioning
confidence: 99%
“…Compared to a rather complex backside chip processing, implementing new material layers on the chip's frontside is advantageous as it provides an additional degree of freedom to improve the photonic chip functionalities and can be more readily integrated into a standard chip-scale fabrication process. More specifically, such grating coupler designs utilize stacks of the same [44][45][46] or different [47][48][49][50][51][52][53][54][55][56] materials to enhance the coupling efficiency. Moreover, this also provides more opportunities for fiber-chip coupling, particularly in terms of multiband [55] or polarization-insensitive [56] operation.…”
Section: Introductionmentioning
confidence: 99%
“…To date, a variety of design strategies for hybrid α-Si/SiN grating couplers has been developed. This includes multi-layer grating configurations 28 , 29 , 33 , mirror-based couplers 34 , 36 , or structures based on an inter-layer mode interference effect 35 . For 800 nm thick SiN waveguides, a technique has been shown to produce a nearly Gaussian radiation profile through multi-mode excitation 34 .…”
Section: Introductionmentioning
confidence: 99%
“…This includes multi-layer grating configurations 28 , 29 , 33 , mirror-based couplers 34 , 36 , or structures based on an inter-layer mode interference effect 35 . For 800 nm thick SiN waveguides, a technique has been shown to produce a nearly Gaussian radiation profile through multi-mode excitation 34 . However, this approach is not suitable for thinner waveguides like the 400 nm SiN platform employed in our work.…”
Section: Introductionmentioning
confidence: 99%
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