2013
DOI: 10.1002/ecj.11500
|View full text |Cite
|
Sign up to set email alerts
|

Cantilever‐Type Thermal Microactuators Fabricated by SOI‐MUMPs with U‐Type and I‐Type Configurations

Abstract: SUMMARY Recently, micro fluid systems have been studied extensively, and microactuators such as micro valves fabricated using MEMS technology are essential for realizing these systems. This paper describes an investigation of thermal microactuators with U‐type and I‐type shapes fabricated by SOI‐MUMPs technology in order to optimize their configurations. © 2013 Wiley Periodicals, Inc. Electron Comm Jpn, 96(12): 46–51, 2013; Published online in Wiley Online Library (http://wileyonlinelibrary.com). DOI 10.1002/e… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2014
2014
2015
2015

Publication Types

Select...
2

Relationship

1
1

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 10 publications
0
1
0
Order By: Relevance
“…While various types of microactuators have been developed, including piezoelectric types , electromagnetic types , electrostatic types , and thermal types , we focused on thermal microactuators, which can facilitate simpler structures and allow larger displacement than other microactuators, and we studied the possibilities of U‐type and I‐type devices . In this paper, we describe thermal microactuators which have a pedestal‐type beam shape modified from the I‐type and a thicker electroplated Au layer, developed in order attain much larger displacements.…”
Section: Introductionmentioning
confidence: 99%
“…While various types of microactuators have been developed, including piezoelectric types , electromagnetic types , electrostatic types , and thermal types , we focused on thermal microactuators, which can facilitate simpler structures and allow larger displacement than other microactuators, and we studied the possibilities of U‐type and I‐type devices . In this paper, we describe thermal microactuators which have a pedestal‐type beam shape modified from the I‐type and a thicker electroplated Au layer, developed in order attain much larger displacements.…”
Section: Introductionmentioning
confidence: 99%