2005
DOI: 10.1016/j.sna.2005.04.026
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Capacitive pressure sensor in post-processing on LTCC substrates

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Cited by 13 publications
(6 citation statements)
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“…The ceramic tape consists of alumina particles and glass particles suspended in an organic binder, which is subsequently fired to form a ceramic structure. [9][10][11] The typical peak sintering temperature of LTCC is 800°C-950°C. 12 The major fabrication processes are shown in Figure 6.…”
Section: Fabrication Of the Sensormentioning
confidence: 99%
“…The ceramic tape consists of alumina particles and glass particles suspended in an organic binder, which is subsequently fired to form a ceramic structure. [9][10][11] The typical peak sintering temperature of LTCC is 800°C-950°C. 12 The major fabrication processes are shown in Figure 6.…”
Section: Fabrication Of the Sensormentioning
confidence: 99%
“…In addition to the packaging method, guide pipes have been used for pressure measurement in an engine running test, which usually cause signal distortion compared to the results obtained from in situ measurement. Therefore, further studies have focused on fabricating sensors by high-temperature-resistant materials such as ceramics [7][8][9], silicon on insulator (SOI) [10], and SiC [11][12][13]. Among these sensors, wireless passive pressure sensors realized by low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC) technology have demonstrated great prospects owing to the combination of passive a telemetry readout method and temperature-resistant material properties.…”
Section: Introductionmentioning
confidence: 99%
“…Compatibility of a thick film and LTCC technologies enables the fabrication of conductive paths and passive components on the surface and buried configurations. The technique is used to fabricate multilayer electronic circuits, sensors, actuators, and microsystems . Fabrication of three‐ dimensional shapes in LTCC ceramics is one of the most important technological steps.…”
Section: Introductionmentioning
confidence: 99%