CARAMEL: Contamination And Reliability Analysis of MicroElectromechanical Layout

Kolpekwar, A.; Jiang, Tao; Blanton, R. D.

doi:10.1109/84.788635

Cited by 18 publications

(7 citation statements)

References 29 publications

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“…Devices with sensitivity deviation within ±5% are treated as ''good'' devices. Devices with sensitivity deviation of ±5%-30% and larger than ±30% are treated as parametric and catastrophic separately [15]. Only ''good'' devices will be counted in the yield analysis, and devices with parametric or catastrophic defects will be discarded.…”

Section: Monte Carlo Simulation Of Point-stiction Defectsmentioning

confidence: 99%

Yield analysis for self-repairable MEMS devices

Xiong

Jone

2008

Analog Integr Circ Sig Process

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In this paper, yield analysis for a self-repairable MEMS (SRMEMS) accelerometer design is proposed. The accelerometer consists of (n + m) identical modules: n of them serve as the main device, while the remaining m modules act as the redundancy. The yield model for MEMS redundancy repair is developed by statistical analysis. Based upon the yield model, the yield increase after redundancy repair for different m and n numbers is analyzed. ANSYS Monte Carlo simulation is used to estimate the yield of BISR/non-BISR MEMS devices with random point-stiction defects. The simulation results are in good agreement with the theoretical prediction based on our yield model. The simulation results also show that the SRMEMS leads to effective yield increase compared to non-BISRS design, especially for a moderate initial yield.

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Section: Monte Carlo Simulation Of Point-stiction Defectsmentioning

confidence: 99%

Yield analysis for self-repairable MEMS devices

Xiong

Jone

2008

Analog Integr Circ Sig Process

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“…The effects of random contamination have been modeled in the CAD program CARAMEL (contamination and reliability analysis of microelectromechanical layout) [76]. The results of CARMEL simulations indicate that a wide range of defective structures are due to the presence of particulate contaminations [76], [77].…”

Section: Environmentally Induced Failurementioning

confidence: 99%

An Overview of Reliability and Failure Mode Analysis of Microelectromechanical Systems (MEMS)

Jiang

Handbook of Performability Engineering

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Abstract:The reliability issues concerning on microelectromechanical systems (MEMS) have steadily developed in recent years. One of the processes to understand MEMS reliability is to know the failure modes of these microdevices. In this chapter, we seek to report on both well known and unknown failure modes of MEMS. Most of the failure patterns are the same in nanoelectromechanical systems (NEMS), because NEMS followed a developmental path similar to that of MEMS in functional design, materials, and fabrication. Therefore, the existing results of MEMS failure modes can be used as a reference to nanoscale system reliability research. The failure modes discussed in this chapter contain stiction, wear, fracture, crystallographic defect, creep, degradation of dielectrics, environmentally induced failure, electric related failure, parasitic capacitance, dampening effects, delamination, and packaging.

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“…It is used for design, stress analysis, fracture and fatigue analysis etc [26,36,29,35]. It is also now being used for fault analysis [3,10,30,31]. It gives an advantage because any non ideal behavior can be modeled easily once the development of the initial model is done successfully.…”

Section: Fault Detection and Prediction In Memsmentioning

confidence: 99%

Optical detection of multiple faults of a MEMS based linear comb resonator

Konduparthi¹

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OPTICAL DETECTION OF MULTIPLE FAULTS ON A MEMS BASEDLINEAR COMB RESONATOR LAKSHMI DEEPASREE KONDUPARTHI Investigating the dynamic behavior of any Micro Electro Mechanical system is critical for better control and fault prediction. Linear Comb Resonator is one such MEMS generic device that I would like to thank my committee members, Dr. Larry Hornak, Dr. Parviz Famouri, and Dr. Dimitris Korakakis. I would like to specially thank Dr.Hornak, my research advisor, for his guidance, patience and support throughout the project. I would also like to thank Dr. Nilay Mukherjee for guiding me through the validation process. I thank Dr.Kolin Brown for his training and constant inputs. I also thank NASA Epscor for funding this project Additionally, I thank members of MEMS research group Afshin Izadian, Limin Wang, William McCormick and Scott Rittenhouse for their help and training in understanding the project. I also would like to thank my colleagues in MSRC for their encouragement. Above all, I thank my parents for motivating and inspiring me to pursue an advanced degree. I also thank my sister for her love and encouragement. In addition I thank my friends and roomates. iv Contents Dedication iii Abstract ii

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CARAMEL: Contamination And Reliability Analysis of MicroElectromechanical Layout

Cited by 18 publications

References 29 publications

Yield analysis for self-repairable MEMS devices

Yield analysis for self-repairable MEMS devices

An Overview of Reliability and Failure Mode Analysis of Microelectromechanical Systems (MEMS)

Optical detection of multiple faults of a MEMS based linear comb resonator

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