Carbon Nanofiber-Copper Composites Fabricated by Electroplating

Abstract

Carbon nanofiber-copper composites are fabricated by composite plating techniques using a plating bath containing an effective dispersing agent for carbon nanofibers. Carbon nanofibers disperse uniformly in the copper matrix, as observed by surface and cross-sectional scanning electron microscopy. By changing electrodeposition parameters, composites with microstructures resembling sea urchins are obtained. Carbon nanotubes and nanofibers 1,2 have superior mechanical characteristics, including high tensile strength and elastic modulus, and superior thermal and electric conductivities. Research into practical applications of carbon nanotubes and nanofibers has been actively pursued, with metal composites containing such unique nanosized materials expected to become promising new materials with innovative functions. However, as carbon nanofibers and nanotubes have lower densities than metals, being 1.9-2.1 g cm Ϫ3 for carbon nanofibers and 1.3-1.4 g cm Ϫ3 for carbon nanotubes, uniformly dispersing nanosized carbon fillers in metal is expected to be difficult. In addition, high-temperature processes are required when melting the metals to produce carbon filler-metal composite. These melting temperatures are usually much higher than the oxidation point of carbon nanotubes and carbon nanofibers, making the use of metals with low melting points necessary. Furthermore, suppressing the formation of metal carbide at the interface between the nanosized filler and metal is important, as this may degrade the performance of the resultant composites.For this reason, attempts were made to develop a lowtemperature composite formation method that can even be used at room temperature. The formation of composite materials by electroplating, such as

Cu–MWCNT Composite Films Fabricated by Electrodeposition

“…In addition, Chen et al investigated the corrosion behavior of Ni-CNT composite coatings. 6 The present authors, as well as others, have reported the fabrication of Cu-CNT [7][8][9] and Ni-CNT [10][11][12] composite films using an electrodeposition technique, and the properties of these films have been investigated. We also reported that copper-multiwalled carbon nanotube ͑Cu-MWCNT͒ composite powder materials with a "sea urchin" shape 13 and Ni-MWCNT composite powder materials with a "skewered dumpling" shape 14 were formed using the electrodeposition technique.…”

Mechanism for Codeposition of Multiwalled Carbon Nanotubes with Copper from Acid Copper Sulfate Bath

“…Since MWCNTs are hydrophobic and did not disperse uniformly in the base copper plating bath, polyacrylic acid (mean molecular weight 5000; PA5000) was employed as a dispersant. [7][8][9][10][11] The dispersibility of the MWCNTs and CB in the plating baths was evaluated using a laser diffraction particle size analyzer (Shimadzu Seisakusho, SALD-7000). Samples of composite plating bath solutions containing 2 g dm −3 of MWCNTs or CB with various concentrations of PA5000 were diluted 150 times with pure water to prepare suitable particle concentrations for the dispersibility measurements.…”

Fabrication of Copper/Single-Walled Carbon Nanotube Composites by Electrodeposition Using Free-Standing Nanotube Film

“…Copper/CNT composites are promising materials, especially in the electronics field, and many fabrication methods, such as spark plasma sintering, [19][20][21][22][23] have been reported. The CNT composite plating has advantages, such as the uniform distribution of CNTs in metal matrices derived from a homogeneous dispersion of CNTs in plating baths, which results in little damage to CNTs due to dispersant addition at room temperature instead of direct grafting of hydrophilic groups that makes CNTs hydrophilic.…”