Synthesis of β-phase silicon carbide (SiC) layers has been achieved by high-dose carbon ion beam implantation into (100) silicon wafers with two different ion implantation energies, 40 keV and 65 keV. Subsequent furnace annealing was carried out in N 2 at temperatures ranging from 600 to 1200 • C for 2 h. Rutherford backscattering spectrometry (RBS) analysis revealed carbon distribution and the formation of an SiC layer. Infrared spectroscopy (IR) exhibited a sharp absorption peak produced by the Si−C bond at 795 cm −1 with full width at half maximum (FWHM) of about 35 cm −1 . A layer of crystalline SiC was formed after annealing the as-implanted sample at 1000 • C for 2 h. The influence of annealing temperature on the surface morphology and the dynamics of the crystallization procedure was studied by atomic force microscopy (AFM). A study of grain size and roughness revealed that the morphology of the SiC layer was largely dependent on annealing temperature, and the average grain size increased as the annealing temperature was raised. At about 900 • C, a layer of nanocrystalline SiC was formed on the sample surface, containing columnar grains with a FWHM of tens of nanometers and a height of less than ten nanometers.The development of silicon carbide (SiC) for electronic applications has been the subject of intense research for a long time. This is stimulated by the extraordinary combined physical properties of this material. SiC-based devices have been developed for specific high-temperature [1], high-power [2] and high-frequency applications that are not suitable for Sior GaAs-based devices [3,4]. Other advantages are extreme hardness, chemical inertness and much higher thermal conductivity than silicon. This is of particular importance for solid state power devices. Moreover, the wide bandgap of SiC (greater than 2.2 eV) leads to extremely low leakage current and high breakdown voltage [9]. These properties make the material of great promise for optoelectronic devices.Techniques for the synthesis of SiC include r.f. glow discharge decomposition, reactive sputtering, chemical vapor deposition [5, 6] and ion implantation [7-9]. Among them, the ion beam synthesis (IBS) method has recently become more attractive for the formation of buried silicon carbide (SiC) materials because of the controllable processing parameters, such as composition and phase [10-12], which are important in determining the structural, optical and electrical properties. This method usually consists of high-dose ion implantation and subsequent high-temperature annealing. Since defect formation and amorphization are associated with the ion implantation process [13], it is necessary to remove these defects and recrystallize the sample by thermal annealing. Of all the existing polymorphs of SiC, α-SiC (6H polytype) and β-SiC (3C polytype) have the most technological interest. α-SiC is the one which appears to be most suitable for the development of SiC technology of integrated circuits, due to the obtaining of 5 cm wafers of single-crystal α-S...