Kinetic thermal degradation of amorphous carbon and carbon nitride films is studied. Significantly improved thermal stability was observed for films intensified with C-N, C=N, and C≡N bonds. When the N 2 % (percentage of nitrogen) in Ar/N 2 during film deposition was varied from 0 to 30 at pressures of 3×10 −3 and 16×10 −3 Torr, the onset decomposition temperatures increased from 396 to 538 and from 340 to 360 • C, while the apparent activation energy E at 60% residual weight increased from 149 to 158 and from 96 to 120 kJ mol −1 , respectively. A change in the thermal stability was observed when the N 2 % reached 50. The films of higher bonding ratio and structural integration showed a single-step decomposition mechanism. They had E values decreasing with the decomposition process, following convextrend isothermal weight-loss curves. Films deposited using low-energy carbon plasma had higher contents of loosely bonded molecules; this resulted in a seemingly two-step decomposition and E increasing with weight loss over a certain range. They followed concave-trend isothermal weight-loss curves. The overall decomposition mechanism could best be expressed in terms of nth-order reactions with the value of n closely related to film structures and reaction temperatures. Lower n-values are related to densely packed structure and higher temperature due to the increased diffusion barrier of the products.