2020
DOI: 10.1016/j.apsusc.2020.145889
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Carrier capture and emission properties of silicon interstitial defects in near SiC/SiO2 interface region

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Cited by 20 publications
(6 citation statements)
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“…This can be achieved by tuning the material composition, crystal structure, and processing conditions to control the concentration and distribution of defects in the material. The of OV can be evaluated using the expression 67 70 as, , where and represent the total energy of the OV-defected and pristine structures, respectively. The number of atoms necessary to create OV is n .…”
Section: Resultsmentioning
confidence: 99%
“…This can be achieved by tuning the material composition, crystal structure, and processing conditions to control the concentration and distribution of defects in the material. The of OV can be evaluated using the expression 67 70 as, , where and represent the total energy of the OV-defected and pristine structures, respectively. The number of atoms necessary to create OV is n .…”
Section: Resultsmentioning
confidence: 99%
“…[ 19 ] Consentient with literature data, [ 16,17 ] our XPS analyses have shown the existence of defects originating from Ge clusters and nonstoichiometric composition of GeO x . As oxygen vacancy defects can capture holes and electrons to form hole traps, [ 21 ] then the NC effect can be thought to be originating from dynamics of these traps. This property is important for the reduction of the noise and parasitic capacitance effect.…”
Section: Resultsmentioning
confidence: 99%
“…Silicon interstitial defects (Si-Si-Si and Si-Si-O configurations) near SiC/SiO 2 at SiO 2 are established, and their charge trapping processes and energy level distributions (figure 14) are studied [75]. Si-Si-Si and Si-Si-O defect configurations can trap electrons and holes, leading to V th instability in SiC MOS devices.…”
Section: Oxide Trapsmentioning
confidence: 99%