Comprehensive Materials Processing 2014
DOI: 10.1016/b978-0-08-096532-1.00409-x
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Cathodic-Arc and Thermal-Evaporation Deposition

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Cited by 14 publications
(4 citation statements)
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“…The physical thermal evaporation deposition technique (PVD) includes a variety of vacuum deposition methods intended for thin films and coatings production [88]. PVD is a powerful process when the material is converted from the condensed phase to the steam phase and then back to the thin layer condensation phase.…”
Section: Thermal Evaporation Techniquementioning
confidence: 99%
“…The physical thermal evaporation deposition technique (PVD) includes a variety of vacuum deposition methods intended for thin films and coatings production [88]. PVD is a powerful process when the material is converted from the condensed phase to the steam phase and then back to the thin layer condensation phase.…”
Section: Thermal Evaporation Techniquementioning
confidence: 99%
“…That is, macroparticles adhere to the structure of a thin coating, where residual stresses are likely to arise. Stresses then lead to the chipping of the coating and the formation of craters on the surface [1,[3][4][5]. Thin films have important applications in mechanical engineering, especially for machining applications [4].…”
Section: Introductionmentioning
confidence: 99%
“…These coatings play an important role due to their high hardness and toughness as well as low coefficients of friction [9,10]. TiN coatings are commercially used for machine tool surfaces due to their high surface hardness, thermochemical stability, and wear resistance [3][4][5]10]. At an elevated temperature of around 250-450 °C, an oxide coating is formed on the TiN surface, and at temperatures higher than ~ 450 °C there is a plastic deformation and coating failure [11] due to oxygen substitution for nitrogen, causing TiO 2 formation leading to phase separation between nitrogen and oxygen [12].…”
Section: Introductionmentioning
confidence: 99%
“…Generally, physical vapor deposition (PVD) can create defects on the surface such as particles, holes, and voids. Many factors such as the overheating of the target, arc spot travel, deposition rate, and bias voltage characteristic can affect the growth of defects due to the change in energy level of ions, which can affect adatom mobility and surface diffusion [14][15][16]. These defects are often minimized because they can lead to inferior coating properties.…”
Section: Introductionmentioning
confidence: 99%