Cavitation Wear of CuZn10 Alloy in As-Cast State and after Plastic Working and Annealing

Abstract

Copper alloys due to their very good corrosion properties are often used to a fabrication of components that are subjected to both a cavitational destruction and a corrosive action of an environment, e.g.. ships’ propellers, sliding elements, pump parts etc. The course of cavitational destruction depends mainly on a material’s structure (a grain size, a type of inclusions, morphology and phase distribution, etc.) but also on the load distribution, and a possible activity of chemical, electrochemical and thermal processes near cavitation bubbles. Properties of a material that is subjected to the cavitational damage are strongly affected by its structure formed upon manufacturing or applied processing. In the present paper, results of the cavitational resistance analysis of CuZn10 alloy in the as cast state (the grain size of 200 μm) and after thermomechanical processing (the grain size of 10 or 200 μm) evaluated on vibrational laboratory stand in accordance with ASTM G-32 standard, are shown.

Research on Crystal Structure Evolution and Failure Mechanism during TSV-Metal Line Electromigration Process

“…Voids, in experience surface diffusion, accelerating the formation of voids [32]. Misorientation is a key parameter to measure the internal micro-strains in the material [33][34][35] and can be used to study the internal micro-strains in the TSV before and after the test. As shown in Figure 12a Misorientation is a key parameter to measure the internal micro-strains in the rial [33][34][35] and can be used to study the internal micro-strains in the TSV before an the test.…”

“…Misorientation is a key parameter to measure the internal micro-strains in the material [33][34][35] and can be used to study the internal micro-strains in the TSV before and after the test. As shown in Figure 12a Misorientation is a key parameter to measure the internal micro-strains in the rial [33][34][35] and can be used to study the internal micro-strains in the TSV before an the test. As shown in Figure 12a,b, the EBSD plots of the lower part of the cathod anode before the test are shown, respectively, while Figure 12c,d show the EBSD p the lower part of the cathode and anode after the test.…”

“…Positions 3, 4, 7, and 9 in Figure 12a have significant misorientation, making them the main locations for hole formation. Similarly, positions 4, 7, and 8 in Figure 12b exhibit notable misorientation, designating them as the primary sites for hole formation [33][34][35]. The misorientation cloud map of the lower section of the TSV cross-section before electromigration is depicted in Figure 13.…”