2010
DOI: 10.1016/j.actamat.2009.12.016
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Ceramic processing strategies for thick films on copper foils

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Cited by 5 publications
(10 citation statements)
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“…Reducing the scale of devices too far results in a reduction in this conversion efficiency as thin films often fail to match the properties exhibited by their parent material due to substrate clamping effects. In addition, the voltage generated by thinner films is lower [15]. This places a limit on the minimum appropriate size of a device which coincides with a requirement for thick films in the range 5-100 µm.…”
Section: A Piezoelectric Energy Harvestersmentioning
confidence: 99%
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“…Reducing the scale of devices too far results in a reduction in this conversion efficiency as thin films often fail to match the properties exhibited by their parent material due to substrate clamping effects. In addition, the voltage generated by thinner films is lower [15]. This places a limit on the minimum appropriate size of a device which coincides with a requirement for thick films in the range 5-100 µm.…”
Section: A Piezoelectric Energy Harvestersmentioning
confidence: 99%
“…Stabilization through the control of pH (2-3 for PZT) has been successfully used to create a 25 wt% PZT suspension for dip coating. Due to the acidic nature of the suspension medium, prolonged exposure will result in leaching of Pb out of the PZT powder [15] reducing performance of the films. In such circumstances steric stabilization would be more appropriate.…”
Section: Immersion Based Techniquesmentioning
confidence: 99%
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“…In addition, it has been used to deposit two kinds of materials on substrates simultaneously17. Many different types of ferroelectric ceramics have been widely used in the EPD process, such as Pb(Zr,Ti)O 3 18192021, K 0.5 Na 0.5 NbO 3 22, BaTiO 3 232425 and BiFeO 3 26. Moreover, the deposition of ferroelectric ceramics on complex substrates, such as helical structures27, individual fibers, fiber mats, and nichrome wires28 has been achieved using EPD.…”
mentioning
confidence: 99%