We have investigated whether negative secondary ion yields from Cs + sputtered silicon might be improved by simultaneous O 2 gas flooding, which lowers the sputter yield of the silicon, and thus, might increase the cesium content at the surface. The composition at the sputtered surface is derived from quantitative measurements of the ratios of O/Si and Cs/Si in the total emitted flux using the recently developed oxygen 18 method [1] and sputter yield measurements, respectively (with X Si + X Cs + X O = 1). The silicon sputter yield, Y, is lowered by adsorbed oxygen by as much as a factor of 2.7 and is found to scale almost linearly with the silicon atom fraction X Si at the surface, resulting in the cesium atom fraction X Cs at the surface remaining nearly constant during oxygen flooding. We find that oxidation of the cesiated silicon surface influences differently the useful ion yields (ions detected/atom sputtered) of various elements. The yields of B − and Cs − are enhanced by factors of 3 and 34, respectively, the yield of O − remains roughly constant, and yields of other elements (As − , Cl − , P − , Sb − , Si − ) are lowered by a factor of 2 or 3.