2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2015
DOI: 10.1109/therminic.2015.7389611
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CFD modelling of thermo-electric devices for thermal management in downhole tools

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“…The idea is to make the convective heat transfer between the absorber tube and the glass envelope negligible, similarly to what is typically done in the lumped parameter models, where a very low heat transfer coefficient is adopted to reach this goal (see section 5.1.4). The imposed thermal conductivity is ≈ 10 -6 W/mK, which is a value already adopted in the literature to simulate evacuated regions (Weerasinghe and Hughes, 2015).…”
Section: Case Of No Windmentioning
confidence: 99%
“…The idea is to make the convective heat transfer between the absorber tube and the glass envelope negligible, similarly to what is typically done in the lumped parameter models, where a very low heat transfer coefficient is adopted to reach this goal (see section 5.1.4). The imposed thermal conductivity is ≈ 10 -6 W/mK, which is a value already adopted in the literature to simulate evacuated regions (Weerasinghe and Hughes, 2015).…”
Section: Case Of No Windmentioning
confidence: 99%