2008
DOI: 10.1117/12.785847
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Challenges and innovations in very-large CCD and CMOS imagers for professional imaging

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Cited by 5 publications
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“…Recently, wafer-level stitching technique has been developed for high-resolution large-scale image sensors; however, it highly relied on foundries to improve yield [4]. Therefore, multiple CIS dies aligned in single package to form a high-resolution image are proposed in this study.…”
Section: Sram (2 Mb)mentioning
confidence: 95%
“…Recently, wafer-level stitching technique has been developed for high-resolution large-scale image sensors; however, it highly relied on foundries to improve yield [4]. Therefore, multiple CIS dies aligned in single package to form a high-resolution image are proposed in this study.…”
Section: Sram (2 Mb)mentioning
confidence: 95%