It
has previously been shown that ex situ phosphorus-doped polycrystalline
silicon on silicon oxide (poly-Si/SiO
x
) passivating contacts can suffer a pronounced surface passivation
degradation when subjected to a firing treatment at 800 °C or
above. The degradation behavior depends strongly on the processing
conditions, such as the dielectric coating layers and the firing temperature.
The current work further studies the firing stability of poly-Si contacts
and proposes a mechanism for the observed behavior based on the role
of hydrogen. Secondary ion mass spectrometry is applied to measure
the hydrogen concentration in the poly-Si/SiO
x
structures after firing at different temperatures and after
removing hydrogen by an anneal in nitrogen. While it is known that
a certain amount of hydrogen around the interfacial SiO
x
can be beneficial for passivation, surprisingly,
we found that the excess amount of hydrogen can deteriorate the poly-Si
passivation and increase the recombination current density parameter J
0. The presence of excess hydrogen is evident
in selected poly-Si samples fired with silicon nitride (SiN
x
), where the injection of additional hydrogen to
the SiO
x
interlayer leads to further degradation
in the J
0, while removing hydrogen fully
recovers the surface passivation. In addition, the proposed model
explains the dependence of firing stability on the crystallite properties
and the doping profile, which determine the effective diffusivity
of hydrogen upon firing and hence the amount of hydrogen around the
interfacial SiO
x
after firing.