Characterisation and simulation of digital device electromagnetic noise under non-ambient temperature conditions

Effects of thermal aggressions on susceptibility responses and immunity figures of PWM patterns

“…In parallel, modeling investigations are also actually performed to try to understand and reproduce these effects of external temperature on EMC characteristics (emission, susceptibility) on electronic PCB, as already initiated for Emissions in [3]. With this modeling completion study, a first complete review of new EMC behavior cases dealing with new embedded and hybrid technology constraints will be validated, so to promote the merging of new concerns of EMC approach on electrical transport and embedded applications [5] …”

Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuit

“…With this first review of thermal-immunity experimental study on PCB, some refinements and calibration progress of the two set-ups have to be completed: the mutual influence on measurements and aggression of both TEM Cell, Near-Field probes and Thermal probes have to be considered. In parallel, modeling investigations are also actually performed to try to understand and reproduce these effects of external temperature on EMC characteristics (emission, susceptibility) on electronic PCB [3]. With this modeling completion study, a first complete review of new EMC behavior cases dealing with new embedded and hybrid technology constraints will be validated, so to promote the merging of new concerns of EMC approach on electrical transport and embedded applications [11]…”

“…The impacts of real physical environment, as temperature, humidity or reliability for conventional Electromagnetic Compatibility (EMC) behavior of hybrid electronic modules are non negligible. Based on both experimental and simulation works, we try to estimate the realistic impact of external temperature on emissions and susceptibility cases of electronic devices [1] [2] [3]. An aggressive, external, quasi-static temperature, with high values as 150°-200°C, can be inherently generated inside and around an electronic device, either by motion thermal systems, or by high-power chip's consumption and radiators associated.…”

Modeling technique of the conducted emission of integrated circuit under different temperatures

“…Therefore it is necessary to include some parameters in the emission modeling, such as the temperature, humidity and aging. In this way, some papers have already been published to evaluate the electrical stress on electromagnetic emissions of IC under different conditions .…”